B23K35/3613

INDIUM SOLDER PASTE COMPOSITIONS
20230049614 · 2023-02-16 ·

The present invention relates to paste compositions comprising an indium metal powder; and an organic vehicle. The organic vehicle includes one or more C8-C18 fatty acids; a salt formed from a C4-C6 carboxylic acid and a tertiary alkanolamine; a cationic catalyst; a thixotrope; and a diluent.

Flux and solder paste

A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.

CARBON-COATED METAL POWDER, CONDUCTIVE PASTE CONTAINING CARBON-COATED METAL POWDER AND MULTILAYER ELECTRONIC COMPONENT USING SAME, AND METHOD FOR MANUFACTURING CARBON-COATED METAL POWDER
20180001388 · 2018-01-04 ·

This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei.

PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
20230238348 · 2023-07-27 · ·

This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.

Systems and methods for welding zinc-coated workpieces

A welding system includes a welding power source configured to provide pulsed electropositive direct current (DCEP), a gas supply system configured to provide a shielding gas flow that is at least 90% argon (Ar), a welding wire feeder configured to provide tubular welding wire. The DCEP, the tubular welding wire, and the shielding gas flow are combined to form a weld deposit on a zinc-coated workpiece, wherein less than approximately 10 wt % of the tubular welding wire is converted to spatter while forming the weld deposit on the zinc-coated workpiece.

Flux, resin flux cored solder, and solder paste

A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE

The invention relates to a method for producing a metal-ceramic substrate and to a furnace suitable for carrying out the method. With the method, a metal-ceramic substrate with increased thermal and current conductivity can be obtained. The method comprises the steps of providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, the solder material comprising a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal, and heating the stack, the stack passing through a heating zone for heating.

Mixed composition coating material for brazing

In a mixed composition coating material for brazing, when a total mass of a solid material, an organic solvent, and water is defined as 100 mass %, the solid material are contained in an amount of 30 mass % or greater and 80 mass % or less with respect to the whole coating material, the organic solvent and the water is contained in a total amount of 20 mass % or greater and 70 mass % or less with respect to the whole coating material, and the water is contained in an amount of 0.4 mass % or greater and 2.5 mass % or less with respect to the whole coating material.

Solder composition

Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25° C. of 5000 mm.sup.2/s or more and 200,000 mm.sup.2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.

Soldering flux and soldering paste

If a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a heating sagging, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of 50 wt ppm or more and 3000 wt ppm or less with respect to a total amount of flux.