An injection mold component for molding the outer surface of a preform neck, which allows improved cooling of the preform neck inside the mold, while at the same time reducing the mold cycle time. A related production process of said injection mold component, which allows the section of the cooling channels to be optimized, determining a more effective cooling, is also described.

A number of variations may include a product that may include a substrate that may include an aluminum-nickel alloy and at least one surface and a coating that may include a metallic material deposited over the at least one surface via laser cladding.

A part formed by additive manufacturing includes a plurality of layers including a first layer and a second layer, the first layer and the second layer being stacked along a stacking direction, and a work surface formed on an upper surface of the first layer and an upper surface of the second layer. The part also includes a first through-hole formed in the first layer, a second through-hole formed in the second layer, the second through-hole being at least partially aligned with the first through-hole, and a wall extending from the first through-hole to the work surface.

The invention provides a method for producing a component (100) having a cooling channel system, the method comprising: building a first portion (10) of the component (100) by means of the additive, integrally bonded application of a build material; and—introducing a first cavity (11) having an opening into the first portion (10) of the component (100). The method is characterized in that it also comprises: covering the opening of the first cavity (11) in the first portion (10) by means of a covering part (13);—building a second portion (20) of the component (100) by means of the additive, integrally bonded application of the build material, the build material being applied to the first portion (10) and to the covering part (13); introducing a second cavity (21) having an opening into the second portion (20) of the component (100); and—introducing a connecting channel (90), (90a) into the component (100) by means of material-removing machining in order to form the cooling channel system, the connecting channel (90), (90a) connecting the second cavity (21) of the second portion (20) to the first cavity (11) of the first portion (10) of the component (100).

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

The present invention provides a bi-metal assembling method. The method provides a machine-shaped aluminum piece and places the machine-shaped aluminum piece into a die-cast mold. The machine-shaped aluminum piece is encapsulated with a magnesium metal liquid and die cast is performed. The assembled bi-metal structure is coated for protection and CNC high-gross treatment and anodizing treatment is performed in the machine-shaped aluminum piece. The magnesium alloy piece is hooked with the machine-shaped aluminum piece for assembling. The bi-metal structure has smooth surface to reduce the time for polishing, surface shrinkage and generation of blowholes. The present invention also provides a bi-metal assembled structure.

Disclosed herein, amongst other things, is a gate and a related method of forming the gate, having structure and steps of providing a base of a first base material, the base having a gate area, adding a layer of a second material to the base in the gate area by an additive manufacturing process to form a metallurgical bond, wherein the second material has a characteristic that differentiates the second material from the first base material and modifying an inner surface in the gate area comprised of the second material to define the gate.

A machine component is formed of a coalesced metal body of multiple zones of material having at least one high hardness surface, along with high yield strength and good thermal conductivity. The coalesced metal body can have a zone of steel and a zone of copper, and have a transition zone in which the zones of steel and copper coalesce. The coalesced metal body has a machined surface on the zone of steel on a first side of the coalesced metal body. The zone of copper has a proximal boundary disposed proximal to, and separated by, the zone of steel, from the machined surface. Also the zone of copper has a distal boundary distal to the machined surface and proximal to a second surface of the coalesced metal body.

A process to increase the diameter of a core rod (1) of an injection mould for preforms, wherein the core rod (1) has a moulding surface (2) divided in a neck finish portion (3) and a preform body portion (4), comprises the steps of: a) grinding or milling a layer from the surface of the preform body portion (4) of the core rod, b) depositing a metallic compound onto the ground portion to make a coating, c) removing the excess of coating material to bring the coated surface to a predetermined superficial roughness and to diametrical dimensions greater than the original surface profile (14) to reduce the thickness of the lateral wall of the moulded preform.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.