Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

A model (8) is based on mathematical-physical equations. The model models the production of a particular output product (1) from at least one input product (2) supplied in each case to an installation in the raw materials industry on the basis of operation (B) of the installation. During production of the output products (1), the installation is controlled by a control device (5) in such a manner that particular actual operation (B) of the installation corresponds as far as possible to particular desired operation (B*) of the installation. The desired operation (B*) is determined by the control device (5) using the model (8) of the installation. The model (8) is parameterized according to a number of first model parameters (P1) for the purpose of modelling the installation. After a multiplicity of output products (1) have been produced in each case, actual sizes (A) of the output products (1) in the particular multiplicity are compared with expected sizes (A′) of the output products (1) in the particular multiplicity. On the basis of the comparison, the first model parameters (P1) are newly determined and the model (8) in the control device (5) is newly parameterized according to the new values of the first model parameters (P1). After this time, the desired operation (B*) is determined by the control device (5) using the newly parameterized model (8) of the installation in the raw materials industry. The expected sizes (A′) are determined by means of the model (8), wherein the determination of the expected sizes (A′) is based on the actual operation (B) of the installation.

A model (8) is based on mathematical-physical equations. The model models the production of a particular output product (1) from at least one input product (2) supplied in each case to an installation in the raw materials industry on the basis of operation (B) of the installation. During production of the output products (1), the installation is controlled by a control device (5) in such a manner that particular actual operation (B) of the installation corresponds as far as possible to particular desired operation (B*) of the installation. The desired operation (B*) is determined by the control device (5) using the model (8) of the installation. The model (8) is parameterized according to a number of first model parameters (P1) for the purpose of modelling the installation. After a multiplicity of output products (1) have been produced in each case, actual sizes (A) of the output products (1) in the particular multiplicity are compared with expected sizes (A′) of the output products (1) in the particular multiplicity. On the basis of the comparison, the first model parameters (P1) are newly determined and the model (8) in the control device (5) is newly parameterized according to the new values of the first model parameters (P1). After this time, the desired operation (B*) is determined by the control device (5) using the newly parameterized model (8) of the installation in the raw materials industry. The expected sizes (A′) are determined by means of the model (8), wherein the determination of the expected sizes (A′) is based on the actual operation (B) of the installation.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.

An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.

A method for manufacturing a torque-transmitting assembly includes turning an inner component and machining an outermost surface of the inner component such that the outermost surface of the inner component has a continuous convex shape. The method further includes turning an external component and machining an innermost surface of the external component such that the innermost surface of the external component has a continuous convex shape. The method also includes heating the innermost surface of the external component to expand a size of the innermost surface after machining the innermost surface of the external component and placing the heated external component onto the inner component while the inner component is maintained at room temperature.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.