A machine tool capable of reducing entry of a workpiece chip into a product discharge chute. A controller controls a receipt of a product made of a workpiece held by a first spindle by a product receiver in a product receiving position, movement of the product receiver to a product dropping position and rotation of the product receiver to drop the product to the product discharge chute through an opening of the product discharge chute, and movement of the product receiver to the product receiving position to receive the product again. A second spindle is kept on standby in the product dropping position during which the opening of the product discharge chute is closed by the product receiver.

A machine tool capable of reducing entry of a workpiece chip into a product discharge chute. A controller controls a receipt of a product made of a workpiece held by a first spindle by a product receiver in a product receiving position, movement of the product receiver to a product dropping position and rotation of the product receiver to drop the product to the product discharge chute through an opening of the product discharge chute, and movement of the product receiver to the product receiving position to receive the product again. A second spindle is kept on standby in the product dropping position during which the opening of the product discharge chute is closed by the product receiver.

A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.

A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.

A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.

A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.

An example method includes performing a machining operation by providing linear movement of a tool along a feed axis relative to a workpiece while superimposing oscillation of the tool onto the feed axis and providing rotation of the tool relative to the workpiece. During an optimization mode, the machining operation is performed on a first workpiece portion while providing the linear movement at an initial feed velocity, and sequentially superimposing the oscillating at a plurality of different frequencies. An optimal oscillation frequency is determined from the plurality of different frequencies which causes the tool to apply less force to the first workpiece portion at the initial feed velocity than others of the frequencies. During a run mode, the machining operation is performed on a second workpiece portion having a same composition as the first workpiece portion while superimposing the oscillation at the optimal oscillation frequency.