A machining center is provided with: a base; a table that supports a workpiece; a main-shaft head that causes a tool to rotate around an axis of rotation of a main-shaft; a Z-axis drive device that causes the table to move with respect to the base along a Z axis parallel to the axis of rotation of the main-shaft; a W-axis drive device that causes the main-shaft head to move with respect to the base along a W axis parallel to the axis of rotation of the main-shaft; and a control device that controls the Z-axis drive device and the W-axis drive device so as to cause the tool to process the workpiece by causing the table and the main-shaft head to move along the Z axis and the W axis, respectively.

A sliding table includes a sliding seat having a seat body made from a first material and disposed between two main rigid rails parallel with each other. The seat body has two opposite rail recesses opening toward the main rigid rails, and two inner cyclic track holes disposed between the rail recesses. Two seat body rigid rails made from a second material harder than the first material are fixed in the rail recesses to confront the main rigid rails. Two roller belt modules are arranged in two cyclic track members overmolded to the seat body. When the seat body moves along the main rigid rails, each roller belt module circulates along one of the cyclic track members.

A sliding table includes a sliding seat having a seat body made from a first material and disposed between two main rigid rails parallel with each other. The seat body has two opposite rail recesses opening toward the main rigid rails, and two inner cyclic track holes disposed between the rail recesses. Two seat body rigid rails made from a second material harder than the first material are fixed in the rail recesses to confront the main rigid rails. Two roller belt modules are arranged in two cyclic track members overmolded to the seat body. When the seat body moves along the main rigid rails, each roller belt module circulates along one of the cyclic track members.

The present disclosure relates to laser machining equipment for grinding semiconductor wafers, and belongs to the field of laser machining equipment. The laser machining equipment mainly comprises a special fixture, laser measuring meters, a laser emission module, an X-axis movement system, a Y-axis movement system, a Z-axis movement system, a liftable laser machining workbench, data transmission cables, an industrial personal computer and a human-computer interface. Compared with conventional wafer grinding equipment, short-pulse lasers are used as wafer grinding tool, and the problems of thermal influence and environmental pollution caused by chemical mechanical grinding method can be solved; laser machining is non-contact machining, so that the problem of wafer breakage caused by mechanical force can be avoided; and a wafer geometric parameter automatic detection system is adopted, automatic measurement of geometric parameters and automatic judgment of machining allowance can be achieved, and the wafer grinding quality can be accurately controlled.

The present disclosure relates to laser machining equipment for grinding semiconductor wafers, and belongs to the field of laser machining equipment. The laser machining equipment mainly comprises a special fixture, laser measuring meters, a laser emission module, an X-axis movement system, a Y-axis movement system, a Z-axis movement system, a liftable laser machining workbench, data transmission cables, an industrial personal computer and a human-computer interface. Compared with conventional wafer grinding equipment, short-pulse lasers are used as wafer grinding tool, and the problems of thermal influence and environmental pollution caused by chemical mechanical grinding method can be solved; laser machining is non-contact machining, so that the problem of wafer breakage caused by mechanical force can be avoided; and a wafer geometric parameter automatic detection system is adopted, automatic measurement of geometric parameters and automatic judgment of machining allowance can be achieved, and the wafer grinding quality can be accurately controlled.

A workpiece rotating apparatus including a first rotary positioner and a second rotary positioner which are arranged to face each other in a direction along a substantially horizontal rotation axis, which hold, respectively, one end portion and the other end portion of a long workpiece, and which can rotate the workpiece around the rotation axis, a linear motor which linearly moves the second rotary positioner in a direction along the rotation axis, and a motor controller which controls the linear motor to adjust a position of the second rotary positioner in a direction along the rotation axis, and the motor controller controls the linear motor so that magnitude of force acting on the linear motor from the other end portion of the workpiece via the second rotary positioner becomes equal to or smaller than a predetermined threshold.

An adjusting device for a machine tool comprises a base body (1), a movable body (2) movable along a moving direction (X) relative to the base body, and a drive (3) for moving the movable body relative to the base body. In order to effectively damp vibrations between the movable body and the base body (in particular so-called stray vibrations) and yet still enable rapid positioning movements of the movable body relative to the base body, the adjusting device comprises an auxiliary body (10) which can be releasably fixed to the base body and, in the released state, can be moved together with the movable body relative to the base body. The adjusting device also comprises at least one vibration damper (11) which is arranged between the auxiliary body and the movable body.

An adjusting device for a machine tool comprises a base body (1), a movable body (2) movable along a moving direction (X) relative to the base body, and a drive (3) for moving the movable body relative to the base body. In order to effectively damp vibrations between the movable body and the base body (in particular so-called stray vibrations) and yet still enable rapid positioning movements of the movable body relative to the base body, the adjusting device comprises an auxiliary body (10) which can be releasably fixed to the base body and, in the released state, can be moved together with the movable body relative to the base body. The adjusting device also comprises at least one vibration damper (11) which is arranged between the auxiliary body and the movable body.

The machining station can include a table; at least three robots each having a multi-axis mover secured to the table, and a gripper opposite the table, the robots being interspaced from one another on the table; and a controller. The controller controls the robots to hold a workpiece in a coordinated manner. The computer numerical command (CNC) machine-tool system machines the workpiece while the workpiece is held by the robots. The workpiece can be moved into and out from the machining station with a trolley which slidingly engages a trolley path formed within the table.

The machining station can include a table; at least three robots each having a multi-axis mover secured to the table, and a gripper opposite the table, the robots being interspaced from one another on the table; and a controller. The controller controls the robots to hold a workpiece in a coordinated manner. The computer numerical command (CNC) machine-tool system machines the workpiece while the workpiece is held by the robots. The workpiece can be moved into and out from the machining station with a trolley which slidingly engages a trolley path formed within the table.