Patent classifications
B24B19/03
METHOD AND APPARATUS FOR LEVELING AND GRINDING SURFACES
A floor leveling apparatus and method for cutting parallel grooves in a hardened body which is configured to assist in utilizing a grinder to finish surfaces in a planar manner.
Method of forming a recess in a substrate
A method of forming a recess in a surface of a substrate includes: providing an abrasive article comprising a structured abrasive member disposed along a peripheral surface of a support member, frictionally contacting the structured abrasive layer with a surface of a substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and rotating at least one of the abrasive article or the substrate relative to the other around a rotational axis perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate. The structured abrasive member comprises a structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member. The shaped abrasive composites comprise abrasive particles retained in a binder material. The present disclosure also provides an abrasive wheel comprises a structured abrasive member disposed on a peripheral surface of a support wheel and display covers including a spherically concave recess abutting a cylindrical passage.
Method of forming a recess in a substrate
A method of forming a recess in a surface of a substrate includes: providing an abrasive article comprising a structured abrasive member disposed along a peripheral surface of a support member, frictionally contacting the structured abrasive layer with a surface of a substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and rotating at least one of the abrasive article or the substrate relative to the other around a rotational axis perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate. The structured abrasive member comprises a structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member. The shaped abrasive composites comprise abrasive particles retained in a binder material. The present disclosure also provides an abrasive wheel comprises a structured abrasive member disposed on a peripheral surface of a support wheel and display covers including a spherically concave recess abutting a cylindrical passage.
METHOD FOR CUTTING WATCH CRYSTALS
Method for cutting a watch crystal along a contour in a plate of transparent material, with the following steps: making, on a first side of the plate, a first cut line or kerf to form a first chamfer, for each crystal of the plate; turning the plate over and marking the position of the first chamfers or of a previously made machined marking; making, on a second side, a second cut line or kerf to form a second chamfer, for each crystal; separating the crystals by machining through the plate at each contour to form an edge of the crystal.
Forming features in a ceramic component for an electronic device
A three-dimensional feature is formed in a surface of a component. Material is removed from the component by rotating an abrading tool about a first axis. While the abrading tool is rotated, the component (and/or a shaft coupled to the abrading tool) is rotated on a second axis. The second axis may be transverse to the first axis and may run through a center of the three-dimensional feature. The abrading tool may correspond to the three-dimensional feature. For example, the abrading tool may be configured to contact an entirety of an exterior of the three-dimensional feature during the removal operation, fill the three-dimensional feature during the removal operation, and/or have a shape that corresponds to the shape of the three-dimensional feature in two planes that are normal to each other.
Forming features in a ceramic component for an electronic device
A three-dimensional feature is formed in a surface of a component. Material is removed from the component by rotating an abrading tool about a first axis. While the abrading tool is rotated, the component (and/or a shaft coupled to the abrading tool) is rotated on a second axis. The second axis may be transverse to the first axis and may run through a center of the three-dimensional feature. The abrading tool may correspond to the three-dimensional feature. For example, the abrading tool may be configured to contact an entirety of an exterior of the three-dimensional feature during the removal operation, fill the three-dimensional feature during the removal operation, and/or have a shape that corresponds to the shape of the three-dimensional feature in two planes that are normal to each other.
FORMING FEATURES IN A CERAMIC COMPONENT FOR AN ELECTRONIC DEVICE
A three-dimensional feature is formed in a surface of a component. Material is removed from the component by rotating an abrading tool about a first axis. While the abrading tool is rotated, the component (and/or a shaft coupled to the abrading tool) is rotated on a second axis. The second axis may be transverse to the first axis and may run through a center of the three-dimensional feature. The abrading tool may correspond to the three-dimensional feature. For example, the abrading tool may be configured to contact an entirety of an exterior of the three-dimensional feature during the removal operation, fill the three-dimensional feature during the removal operation, and/or have a shape that corresponds to the shape of the three-dimensional feature in two planes that are normal to each other.