A floor leveling apparatus and method for cutting parallel grooves in a hardened body which is configured to assist in utilizing a grinder to finish surfaces in a planar manner.

A floor leveling apparatus and method for cutting parallel grooves in a hardened body which is configured to assist in utilizing a grinder to finish surfaces in a planar manner.

Disclosed herein is an apparatus and/or device to scrape a hard disk drive (HDD) to completely and permanently erase, remove, and/or destroy digital and/or electronic data and/or information stored on and/or written to the HDD without using and/or necessitating the use of external induction. The apparatus includes a first part of a HDD scrapper mounted on an arm of the HDD and a second part of the HDD scrapper mounted on a scrapper head. The apparatus also includes a turner that simultaneously permits a turning operation of magnetic platters of the HDD and the HDD scrapper. The first part, the second part, the arm, the scrapper head, the turner, and the magnetic platters are included in an enclosure of the HDD.

Disclosed herein is an apparatus and/or device to scrape a hard disk drive (HDD) to completely and permanently erase, remove, and/or destroy digital and/or electronic data and/or information stored on and/or written to the HDD without using and/or necessitating the use of external induction. The apparatus includes a first part of a HDD scrapper mounted on an arm of the HDD and a second part of the HDD scrapper mounted on a scrapper head. The apparatus also includes a turner that simultaneously permits a turning operation of magnetic platters of the HDD and the HDD scrapper. The first part, the second part, the arm, the scrapper head, the turner, and the magnetic platters are included in an enclosure of the HDD.

A method for cutting watch crystals along a plurality of contours in a plate of transparent material includes forming a first cut line or kerf to form a first chamfer for each of the crystals of the plate and marking at least one machined recess on a first side of the plate, turning the plate over and marking at least one of the position of the first chamfer and the position of the at least one machined recess, forming a second cut line or kerf to form a second chamfer for each of the crystals on a second side of the plate, and separating the crystals by machining through the plate at each of the contours to form edges of the crystals.

A method for cutting watch crystals along a plurality of contours in a plate of transparent material includes forming a first cut line or kerf to form a first chamfer for each of the crystals of the plate and marking at least one machined recess on a first side of the plate, turning the plate over and marking at least one of the position of the first chamfer and the position of the at least one machined recess, forming a second cut line or kerf to form a second chamfer for each of the crystals on a second side of the plate, and separating the crystals by machining through the plate at each of the contours to form edges of the crystals.

Disclosed herein is an apparatus and/or device to scrape a hard disk drive (HDD) to completely and permanently erase, remove, and/or destroy digital and/or electronic data and/or information stored on and/or written to the HDD without using and/or necessitating the use of external induction. The apparatus includes a first part of a HDD scrapper mounted on an arm of the HDD and a second part of the HDD scrapper mounted on a scrapper head. The apparatus also includes a turner that simultaneously permits a turning operation of magnetic platters of the HDD and the HDD scrapper. The first part, the second part, the arm, the scrapper head, the turner, and the magnetic platters are included in an enclosure of the HDD.

Disclosed herein is an apparatus and/or device to scrape a hard disk drive (HDD) to completely and permanently erase, remove, and/or destroy digital and/or electronic data and/or information stored on and/or written to the HDD without using and/or necessitating the use of external induction. The apparatus includes a first part of a HDD scrapper mounted on an arm of the HDD and a second part of the HDD scrapper mounted on a scrapper head. The apparatus also includes a turner that simultaneously permits a turning operation of magnetic platters of the HDD and the HDD scrapper. The first part, the second part, the arm, the scrapper head, the turner, and the magnetic platters are included in an enclosure of the HDD.

Provided are a quartz glass member with an increased exposure area, which has an increased exposure area to a film formation treatment gas as compared to a member having a flat surface and has the increased exposure area controlled so that a constant adsorption amount of the film formation treatment gas onto a surface thereof is achieved, a method for manufacturing the quartz glass member with an increased exposure area, and a blade with multiple peripheral cutting edges to be used for the method. The quartz glass member with an increased exposure area is a quartz glass member for exposure to a film formation treatment gas to be, in film formation treatment of a semiconductor substrate, placed in a reaction chamber together with the semiconductor substrate to be subjected to the film formation treatment and exposed to the film formation treatment gas, the quartz glass member including: a quartz glass member main body; and a plurality of irregularities formed on a surface of the quartz glass member main body, the exposure area of the quartz glass member to the film formation treatment gas being controlled and increased.

Provided are a quartz glass member with an increased exposure area, which has an increased exposure area to a film formation treatment gas as compared to a member having a flat surface and has the increased exposure area controlled so that a constant adsorption amount of the film formation treatment gas onto a surface thereof is achieved, a method for manufacturing the quartz glass member with an increased exposure area, and a blade with multiple peripheral cutting edges to be used for the method. The quartz glass member with an increased exposure area is a quartz glass member for exposure to a film formation treatment gas to be, in film formation treatment of a semiconductor substrate, placed in a reaction chamber together with the semiconductor substrate to be subjected to the film formation treatment and exposed to the film formation treatment gas, the quartz glass member including: a quartz glass member main body; and a plurality of irregularities formed on a surface of the quartz glass member main body, the exposure area of the quartz glass member to the film formation treatment gas being controlled and increased.