Patent classifications
B24B3/28
POLISHING PAD AND POLISHING METHOD
There is provided a polishing pad that ensures sufficiently performing polishing up to a part near a projection portion and an inner surface of a recessed portion in a surface of an object to be polished in polishing the object to be polished having a surface with at least one of the projection portion and the recessed portion. The polishing pad includes a napped part (1) where a plurality of fibers (12) with a length of 3 mm or more are napped on a surface of a base portion (11). A count of the fibers (12) is 10000 pieces/cm.sup.2 or more.
POLISHING PAD AND POLISHING METHOD
There is provided a polishing pad that ensures sufficiently performing polishing up to a part near a projection portion and an inner surface of a recessed portion in a surface of an object to be polished in polishing the object to be polished having a surface with at least one of the projection portion and the recessed portion. The polishing pad includes a napped part (1) where a plurality of fibers (12) with a length of 3 mm or more are napped on a surface of a base portion (11). A count of the fibers (12) is 10000 pieces/cm.sup.2 or more.