The present invention relates to a measuring steady rest which has a device for supporting central workpiece regions, in particular, bearing points on shaft parts, in particular crankshafts, and a measurement device integrated therein for directly adjusting the measurement of the workpiece regions before and/or during machining of the shaft parts. The measuring steady rest is preferably designed in the form of a prism, the measurement device being arranged on the bottom of the prism between the lateral flanks of the prism. The present invention further relates to a grinding machine comprising such a measuring steady rest, and to a method for supporting and measuring central workpiece regions on such a grinding machine comprising such a measuring steady rest.

The present invention relates to a measuring steady rest which has a device for supporting central workpiece regions, in particular, bearing points on shaft parts, in particular crankshafts, and a measurement device integrated therein for directly adjusting the measurement of the workpiece regions before and/or during machining of the shaft parts. The measuring steady rest is preferably designed in the form of a prism, the measurement device being arranged on the bottom of the prism between the lateral flanks of the prism. The present invention further relates to a grinding machine comprising such a measuring steady rest, and to a method for supporting and measuring central workpiece regions on such a grinding machine comprising such a measuring steady rest.

Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a wafer, and a first grinding feed unit and a second grinding feed unit that execute grinding feed of them. Each grinding feed unit has a pair of guides parallel to the grinding feed direction and a ball screw. The grinding area of each grinding unit has a circular arc shape in which one end exists at the outer circumference of the wafer and the other end exists at the center of the wafer.

Grinding apparatus includes plural chuck tables disposed on a turntable, a first grinding unit and a second grinding unit that execute infeed grinding of a wafer, and a first grinding feed unit and a second grinding feed unit that execute grinding feed of them. Each grinding feed unit has a pair of guides parallel to the grinding feed direction and a ball screw. The grinding area of each grinding unit has a circular arc shape in which one end exists at the outer circumference of the wafer and the other end exists at the center of the wafer.

Precise surface treatment and finishing of an enclosed, non-linear channel through a 3-dimensional printed, additively manufactured or machined part or workpiece results from insertion of a grinding wheel on a flexible shaft and controlling an orbital movement though rotational speed, grit selection and fluid viscosity of a liquid medium in the channel. Drive logic rotates the flexible shaft for controlled rotation as the orbital movement or pattern achieves controlled contact with the interior channel surface. Rotational contact by the grinding wheel removes material based on a grit size, while the orbit is controlled through the rotation, viscosity and grit size for achieving uniform coverage of the interior surface. An internal geometry, typically circular or elliptical, is preserved while attaining a smooth surface through precise material removal resulting from the controlled orbit.