An AE-signal detecting device for an abrasive wheel includes: an AE sensor which outputs an AE signal upon receipt of an elastic wave generated in an annular abrasive wheel sandwiched between a fixed flange fixed to a rotating shaft and a movable flange provided capable of getting closer to/separating from the fixed flange; a transmission circuit portion which wirelessly transmits the AE signal output from the AE sensor; and a reception circuit portion which receives the AE signal transmitted wirelessly, wherein the AE sensor is disposed on the movable flange or the fixed flange, detects the elastic wave transmitted from the abrasive wheel, and outputs the AE signal.

An apparatus for chemical mechanical polishing of a wafer includes a process chamber and a rotatable platen disposed inside the process chamber. A polishing pad is disposed on the platen and a wafer carrier is disposed on the platen. A slurry supply port is configured to supply slurry on the platen. A process controller is configured to control operation of the apparatus. A set of microphones is disposed inside the process chamber. The set of microphones is arranged to detect sound in the process chamber during operation of the apparatus and transmit an electrical signal corresponding to the detected sound. A signal processor is configured to receive the electrical signal from the set of microphones, process the electrical signal to enable detection of an event during operation of the apparatus, and in response to detecting the event, transmit a feedback signal to the process controller. The process controller is further configured to receive the feedback signal and initiate an action based on the received feedback signal.

A process for support material removal for 3D printed parts wherein the part is placed in a media filled tank and support removal is optimized in a multi-parameter system through an artificial intelligence process which may include, but is not limited to, the use of historical data, parametric testing data, normal support removal data, and outputs from other support removal AI models to generate optimally efficient use of each parameter in terms of pulse repetition interval (PRI) and cycle time as defined by pulse width (PW). The input parameters may include heat, circulation, ultrasound and chemical reaction, which are used in sequence and/or in parallel, to optimize efficiency of support removal. Sequentially and/or in parallel, heat, pump circulation and ultrasound may vary in application or intensity. Selection of means of agitation depends on monitored feedback from the support removal tank and application of a statistically dynamic rule based system (SDRBS).

A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to detect planarization of topology on the substrate based on a signal from the in-situ acoustic monitoring system.

In one embodiment, a method is provided for polishing a substrate. The method generally includes receiving a plurality of dwell times of a pad conditioning disk, wherein the plurality of dwell times are to be used in a pad conditioning process performed on a pad disposed on a platen, and each dwell time corresponding to a zone of a plurality of zones of the pad disposed on the platen, determining a plurality of total pad conditioning disk cut times to be used in the pad conditioning process, each total pad conditioning disk cut time corresponding to a zone of the plurality of zones, and generating a first pad wear removal model based on a set of parameters, including the plurality of dwell times and the plurality of total pad conditioning disk cut times.

An apparatus for automated polishing of an object with multiple facets includes a polishing wheel, a robotic arm, a sensor and a controller. The robotic arm positions the object in contact with the polishing wheel. The sensor senses a polishing related parameter during polishing of the object with the polishing wheel. The controller operates the robotic arm to rotate the object about an axis perpendicular to the polishing wheel, receives a sensing signal from said sensor at different orientations of said object during polishing and selects a polishing orientation from the different orientations based on said sensing signal.

A probe grinding device by acoustic positioning includes a fixing base, a grinding base, a rotating module, a motor module, a moving module, a processing module, an acoustic sensing module, and a memory module. The fixing base fixes a probe card. The acoustic sensing module generates and transmits an acoustic sensing signal to the processing module. The memory module stores a grinding audio of a grinding audio data. When the processing module drives the rotating module and the moving module via the motor module, the processing module determines whether the acoustic sensing signal matches the grinding audio. When the acoustic sensing signal matches the grinding audio, the processing module drives the moving module to slowly move the grinding base to avoid damaging the probes.

The present invention provides a measurement device for grinding wheel. One or more thickness measurement device is disposed slidably on a platform. A spinning device is disposed on the platform. A grinding wheel is fixed on the spinning device. The spinning shaft spins the grinding wheel. The one or more thickness measurement device measures the flatness condition of the grinding wheel. Furthermore, according to the present invention, a diameter measurement device is disposed inside the platform and measures the roundness of the outer periphery of the grinding wheel. Since the structure can be disassembled easily, the whole measurement device for grinding wheel can be carried conveniently. In addition, measurements can be performed by users on the site where the grinding wheel is located for real-timely understanding the real size and wear condition of grinding wheel.

A grinding machine including one or more grinding wheels has a workpiece holder that releasably holds a crankshaft and is configured to rotate the crankshaft about a longitudinal axis; a spindle assembly, that is moveable in at least two directions, including a spindle shaft and a grinding wheel attached to the spindle shaft; and an acoustic emission sensor coupled to the grinding machine, such that the grinding machine is configured to monitor an output signal from the acoustic emission sensor, move the grinding wheel into contact with the crankshaft at a first angular position, detect contact between the grinding wheel and the crankshaft based on the output signal, determine a position of the grinding wheel based on the detected contact between the grinding wheel and the crankshaft, move the grinding wheel away from the crankshaft, rotate the crankshaft a defined angular amount, move the grinding wheel into contact with the crankshaft at a second angular position, determine a position of the grinding wheel based on the detected contact between the grinding wheel and the crankshaft, and determine a position of a crankshaft surface.

A CMP system includes a polishing apparatus configured to polish a wafer and roll cleaning apparatus, which includes a rotating roll brush configured to roll against a surface of the wafer during operation, a fluid supply system configured to apply a fluid on the surface of the wafer, and an array of liquid sensors configured to detect a distribution of the fluid on the surface of the wafer in areas that are not covered by the rotating roll brush.