A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

The sum of torques: the torque of the sun gear and the torque of the internal gear, and the ratio of the torques are controlled within predetermined ranges.

A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

Disclosed is a method for determining location of a lens machining tool (24) having an offset location according to a first direction (Y) smaller than a first predetermined threshold, including the steps of manufacturing a calibration piece (10) according to a predetermined theoretical geometry by using the lens machining tool for providing a at least partially annular groove in a main surface of the calibration piece, the at least partially annular groove being configured to form at least one sharp edge defining a slope discontinuity on the main surface; measuring a distance between the at least one sharp edge and a turning center of the calibration piece for providing data of geometrical characteristics of the calibration piece; and deducing from the measured data a location of the lens machining tool according to a second direction (X) distinct from the first direction.

Disclosed is a method for determining location of a lens machining tool (24) having an offset location according to a first direction (Y) smaller than a first predetermined threshold, including the steps of manufacturing a calibration piece (10) according to a predetermined theoretical geometry by using the lens machining tool for providing a at least partially annular groove in a main surface of the calibration piece, the at least partially annular groove being configured to form at least one sharp edge defining a slope discontinuity on the main surface; measuring a distance between the at least one sharp edge and a turning center of the calibration piece for providing data of geometrical characteristics of the calibration piece; and deducing from the measured data a location of the lens machining tool according to a second direction (X) distinct from the first direction.

A double-side polishing method for a work includes: a pre-polishing index calculation step of calculating an index Xp for a work having been subjected to double-side polishing in the last batch; a target polishing time calculation step of calculating a target polishing time of the current batch using a predetermined prediction formula; and a double-side polishing step of performing double-side polishing of a work using the target polishing time. A double-side polishing apparatus for a work includes: a measurement unit for measuring thicknesses of a work having been subjected to double-side polishing in the last batch; a first calculation unit calculating an index Xp; a second calculation unit calculating a target polishing time Tt of the current batch using a predetermined prediction formula; and a control unit controlling double-side polishing of the work using the calculated target polishing time Tt.

According to one example, a CNC machine tool system may perform error compensation for improving the accuracy of the geometry (or form) of a machined workpiece to, for example, better than 2 micrometers. To do so, a first machined workpiece may be created using the CNC machine tool system. The CNC machine tool system may create the machined workpiece by jig grinding. Following the creation of the first machined workpiece, metrology of the workpiece error may then be performed on the machined workpiece. The metrology of the workpiece error may be used to create a corrected toolpath trajectory for re-machining. This corrected toolpath trajectory may then be utilized by the CNC machine tool system to machine a second machined workpiece having a geometry (or form) with an accuracy of, for example, better than 2 micrometers.

A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.