A method of machining a workpiece using a machine tool, the machine tool comprising a tool mount carrying a tool, a workpiece mount carrying a workpiece, a drive mechanism for moving at least one of the tool mount and the workpiece mount relative to the other, and a control arrangement for controlling the drive mechanism. The method comprises moving at least one of the tool mount and the workpiece mount with the drive mechanism under the control of the control arrangement so that the tool contacts a portion of the workpiece to commence a machining operation, and the tool then removes material from the portion of the workpiece until completion of the machining operation, the movement being such that the relative velocity between the tool and the workpiece decreases continuously during the majority of the time that the tool and the workpiece are in contact with each other during the machining operation.

A method of machining a workpiece using a machine tool, the machine tool comprising a tool mount carrying a tool, a workpiece mount carrying a workpiece, a drive mechanism for moving at least one of the tool mount and the workpiece mount relative to the other, and a control arrangement for controlling the drive mechanism. The method comprises moving at least one of the tool mount and the workpiece mount with the drive mechanism under the control of the control arrangement so that the tool contacts a portion of the workpiece to commence a machining operation, and the tool then removes material from the portion of the workpiece until completion of the machining operation, the movement being such that the relative velocity between the tool and the workpiece decreases continuously during the majority of the time that the tool and the workpiece are in contact with each other during the machining operation.

A method of removing material from a surface of an ultrasound directing element comprising a plastic material is provided. The method includes mounting the ultrasound directing element to a mounting block of a sanding apparatus. The mounting block includes an engagement member that moves from a release position to an engagement position thereby engaging the ultrasound directing element. The mounting block is moved along a base of the sanding apparatus bringing a surface of the ultrasound directing element into contact with a sanding surface. Material is removed from the surface of the ultrasound directing element using the sanding surface.

A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to detect planarization of topology on the substrate based on a signal from the in-situ acoustic monitoring system.

A system and method for polishing a substrate, and a retaining ring assembly therefor, are described herein. A retaining ring assembly is configured to be attached to a carrier head. The retaining ring assembly includes a retaining ring including a lower surface, an inner surface, an outer surface and a plurality of grooves, where the lower surface is configured to contact a polishing pad during a polishing process, and each of the plurality of grooves are formed in the lower surface and extend from the inner surface to the outer surface. The retaining ring assembly includes a plurality of retainers, each retainer including a movable tooth at least partially disposed in a respective groove of the retaining ring and moveable relative to the lower surface.

The present invention discloses a planogrinder including a measuring device, wherein the measuring device can move along the X-axis direction, an optical probe is provided at one end of the measuring device close to a bed base, and the optical probe is used for real-time detection of an outer diameter of a workpiece being machined. The planogrinder provided by the present invention can measure dimensions of the workpiece during rotation through the measuring device, and can control the deformation of the workpiece during the rotation process, thereby making the machining accuracy of the workpiece controllable during use.

The present invention discloses a planogrinder including a measuring device, wherein the measuring device can move along the X-axis direction, an optical probe is provided at one end of the measuring device close to a bed base, and the optical probe is used for real-time detection of an outer diameter of a workpiece being machined. The planogrinder provided by the present invention can measure dimensions of the workpiece during rotation through the measuring device, and can control the deformation of the workpiece during the rotation process, thereby making the machining accuracy of the workpiece controllable during use.

A rotation controlling section of a control unit calculates a maximum thicknesswise difference in a wafer by using a noncontact thickness measuring instrument, and if the maximum thicknesswise difference exceeds a tolerance, relatively changes a rotational speed of a chuck table relative to a rotational speed of a spindle. This can shift a rotational speed ratio, which is a ratio between the rotational speed of the spindle and the rotational speed of the chuck table, from an integer. Therefore, the maximum thicknesswise difference can be made small through spark-out processing. As a result, cyclic variations in thickness value of the wafer are reduced, enabling planarization of a ground surface of the wafer.

A rotation controlling section of a control unit calculates a maximum thicknesswise difference in a wafer by using a noncontact thickness measuring instrument, and if the maximum thicknesswise difference exceeds a tolerance, relatively changes a rotational speed of a chuck table relative to a rotational speed of a spindle. This can shift a rotational speed ratio, which is a ratio between the rotational speed of the spindle and the rotational speed of the chuck table, from an integer. Therefore, the maximum thicknesswise difference can be made small through spark-out processing. As a result, cyclic variations in thickness value of the wafer are reduced, enabling planarization of a ground surface of the wafer.

A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.