An apparatus for automated polishing of an object with multiple facets includes a polishing wheel, a robotic arm, a sensor and a controller. The robotic arm positions the object in contact with the polishing wheel. The sensor senses a polishing related parameter during polishing of the object with the polishing wheel. The controller operates the robotic arm to rotate the object about an axis perpendicular to the polishing wheel, receives a sensing signal from said sensor at different orientations of said object during polishing and selects a polishing orientation from the different orientations based on said sensing signal.

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.

A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.

An assistance apparatus includes a status information acquiring section that acquires a grinding condition as a status information, the grinding condition including set states associated with a plurality of movement command data, an evaluation result acquiring section that acquires evaluation results of a plurality of evaluation objects that are obtained under the grinding condition, a reward calculating section that calculates a reward for the status information based on the evaluation results, a policy storing section that stores a policy which is obtained from a value function, an action determining section that determines the movement command data to be adjusted and an adjustment amount at which said movement command data is adjusted, from among candidates of the plurality of movement command data that are adjustable, based on the status information and the policy, and an action information outputting section that is configured to output determined contents including an action information.

An assistance apparatus includes a status information acquiring section that acquires a grinding condition as a status information, the grinding condition including set states associated with a plurality of movement command data, an evaluation result acquiring section that acquires evaluation results of a plurality of evaluation objects that are obtained under the grinding condition, a reward calculating section that calculates a reward for the status information based on the evaluation results, a policy storing section that stores a policy which is obtained from a value function, an action determining section that determines the movement command data to be adjusted and an adjustment amount at which said movement command data is adjusted, from among candidates of the plurality of movement command data that are adjustable, based on the status information and the policy, and an action information outputting section that is configured to output determined contents including an action information.

There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable, a substrate holding unit configured to hold the object to be polished and pressing the object to be polished against the polishing pad, and a polishing-liquid removing unit configured to remove polishing liquid from the polishing surface. The polishing-liquid removing unit includes a rinse unit configured to jet cleaning liquid onto the polishing surface and a sucking unit configured to suck the polishing liquid on the polishing surface onto which the cleaning liquid is jetted. The rinse unit includes a cleaning space surrounded by a sidewall. The sidewall includes an opening section for opening the cleaning space toward a radial direction outer side of the polishing table.

A pipe coating removal apparatus (1) for removing all or some of the coating on a pipe, the pipe coating removal apparatus (1) having a pipe support means (2) for supporting a length of pipe. and further having a tool carriage (3). The tool carriage (3) being capable of supporting two or more different types of pipe coating removal tools (4), (5), (6), (7), (8), (80), (81), (82) and/or (70). The pipe coating removal apparatus (1) being capable of causing relative movement between the tool carriage (3) and the pipe support means (2) to remove all or some of the coating on the pipe that is supportable by the pipe support means (2).

A pipe coating removal apparatus (1) for removing all or some of the coating on a pipe, the pipe coating removal apparatus (1) having a pipe support means (2) for supporting a length of pipe. and further having a tool carriage (3). The tool carriage (3) being capable of supporting two or more different types of pipe coating removal tools (4), (5), (6), (7), (8), (80), (81), (82) and/or (70). The pipe coating removal apparatus (1) being capable of causing relative movement between the tool carriage (3) and the pipe support means (2) to remove all or some of the coating on the pipe that is supportable by the pipe support means (2).