A polishing assembly for polishing of silicon wafers includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.

A polishing assembly for polishing of silicon wafers includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.

A process for support material removal for 3D printed parts wherein the part is placed in a media filled tank and support removal is optimized in a multi-parameter system through an artificial intelligence process which may include, but is not limited to, the use of historical data, parametric testing data, normal support removal data, and outputs from other support removal AI models to generate optimally efficient use of each parameter in terms of pulse repetition interval (PRI) and cycle time as defined by pulse width (PW). The input parameters may include heat, circulation, ultrasound and chemical reaction, which are used in sequence and/or in parallel, to optimize efficiency of support removal. Sequentially and/or in parallel, heat, pump circulation and ultrasound may vary in application or intensity. Selection of means of agitation depends on monitored feedback from the support removal tank and application of a statistically dynamic rule based system (SDRBS).

A process for support material removal for 3D printed parts wherein the part is placed in a media filled tank and support removal is optimized in a multi-parameter system through an artificial intelligence process which may include, but is not limited to, the use of historical data, parametric testing data, normal support removal data, and outputs from other support removal AI models to generate optimally efficient use of each parameter in terms of pulse repetition interval (PRI) and cycle time as defined by pulse width (PW). The input parameters may include heat, circulation, ultrasound and chemical reaction, which are used in sequence and/or in parallel, to optimize efficiency of support removal. Sequentially and/or in parallel, heat, pump circulation and ultrasound may vary in application or intensity. Selection of means of agitation depends on monitored feedback from the support removal tank and application of a statistically dynamic rule based system (SDRBS).

A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.

The present invention relates to a device for polishing a specimen (104, 204). The device comprises a polishing platen (101, 201) rotatable about an axis, a polishing pad (103, 203) attached to the polishing platen (101, 201), a specimen holder (105, 205) for holding the specimen (104, 204) against the polishing pad (103, 203), means (107, 110, 207, 212) for measuring a physical quantity in a plurality of positions on the polishing pad (103, 203), the physical quantity being indicative of the moisture or the friction, and means (116, 119, 120, 121, 213, 215, 216, 217) for dispensing a polishing suspension, based on values of the measured physical quantity, to the plurality of positions on the polishing pad (103, 203). The invention also relates to a method for polishing a specimen (104, 204).

The present invention relates to a device for polishing a specimen (104, 204). The device comprises a polishing platen (101, 201) rotatable about an axis, a polishing pad (103, 203) attached to the polishing platen (101, 201), a specimen holder (105, 205) for holding the specimen (104, 204) against the polishing pad (103, 203), means (107, 110, 207, 212) for measuring a physical quantity in a plurality of positions on the polishing pad (103, 203), the physical quantity being indicative of the moisture or the friction, and means (116, 119, 120, 121, 213, 215, 216, 217) for dispensing a polishing suspension, based on values of the measured physical quantity, to the plurality of positions on the polishing pad (103, 203). The invention also relates to a method for polishing a specimen (104, 204).

A method for controlling operation of an abrading system (500) comprises: —providing an abrading head (300), which comprises an abrading device (200) and a communication unit (MOD1), —providing parameter data (PAR1) associated with the abrading device (200), —storing the parameter data (PAR1) into a memory (MEM2) of the communication unit (MOD1), —transporting the abrading head (300) to an abrading site (SITE1), —electrically connecting the abrading head (300) to a driving unit (400) at the abrading site (SITE1), —transferring the parameter data (PAR1) from the communication unit (MOD1) to the driving unit (400) at the abrading site (SITE1), and —driving an electric motor (MOTOR1) of the abrading device (200) with the driving unit (400) according to the parameter data (PAR1).

A method for controlling operation of an abrading system (500) comprises: —providing an abrading head (300), which comprises an abrading device (200) and a communication unit (MOD1), —providing parameter data (PAR1) associated with the abrading device (200), —storing the parameter data (PAR1) into a memory (MEM2) of the communication unit (MOD1), —transporting the abrading head (300) to an abrading site (SITE1), —electrically connecting the abrading head (300) to a driving unit (400) at the abrading site (SITE1), —transferring the parameter data (PAR1) from the communication unit (MOD1) to the driving unit (400) at the abrading site (SITE1), and —driving an electric motor (MOTOR1) of the abrading device (200) with the driving unit (400) according to the parameter data (PAR1).

An apparatus for automated polishing of an object with multiple facets includes a polishing wheel, a robotic arm, a sensor and a controller. The robotic arm positions the object in contact with the polishing wheel. The sensor senses a polishing related parameter during polishing of the object with the polishing wheel. The controller operates the robotic arm to rotate the object about an axis perpendicular to the polishing wheel, receives a sensing signal from said sensor at different orientations of said object during polishing and selects a polishing orientation from the different orientations based on said sensing signal.