A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

The present invention relates to a method and a device for processing a hard-coated workpiece surface of a rotationally symmetrical workpiece (1) with at least one grinding wheel, wherein the method comprises the following steps: driving the workpiece (1) into a rotational motion around a workpiece axis of rotation (1.1), driving a grinding wheel (2a) into a rotational motion around a grinding wheel axis of rotation (2a.1), angulating the grinding wheel axis of rotation (2a.1) and the workpiece axis of rotation (1.1) to each other so that the grinding wheel axis of rotation (2a.1) and the workpiece axis of rotation (1.1) are not parallel, processing the workpiece surface with the grinding wheel (2a), wherein the grinding wheel (2a) is in contact with the workpiece surface.

A microbial dressing method for super abrasive tools includes a kind of microbe which is capable of consuming the bond in a certain manner is selected to perform the microbial dressing. Specifically, the microbe is inoculated and cultured in the culture medium to a certain concentration, then the dressing area of the abrasive tool is immersed into the culture liquid to remove the bond in the surface by the action of the microbe, and the control of the dressing amount is realized by controlling the microbe concentration and the soaking time. Precise dressing for super abrasive products, particularly for fine grained abrasive tools can be realized using the present method.

A microbial dressing method for super abrasive tools includes a kind of microbe which is capable of consuming the bond in a certain manner is selected to perform the microbial dressing. Specifically, the microbe is inoculated and cultured in the culture medium to a certain concentration, then the dressing area of the abrasive tool is immersed into the culture liquid to remove the bond in the surface by the action of the microbe, and the control of the dressing amount is realized by controlling the microbe concentration and the soaking time. Precise dressing for super abrasive products, particularly for fine grained abrasive tools can be realized using the present method.

A method of shaping a cutting blade, includes a modified layer forming step of forming a plurality of modified layers at different heights within a dressing member by irradiating the dressing member with a laser beam having a wavelength transmissible through the dressing member from one surface of the dressing member a plurality of times while a focusing point of the laser beam is positioned within the dressing member, and a blade shaping step of shaping the cutting blade into a predetermined shape formed by the plurality of modified layers by cutting the dressing member by the cutting blade until the cutting blade reaches the modified layers after performing the modified layer forming step.

A method of shaping a cutting blade, includes a modified layer forming step of forming a plurality of modified layers at different heights within a dressing member by irradiating the dressing member with a laser beam having a wavelength transmissible through the dressing member from one surface of the dressing member a plurality of times while a focusing point of the laser beam is positioned within the dressing member, and a blade shaping step of shaping the cutting blade into a predetermined shape formed by the plurality of modified layers by cutting the dressing member by the cutting blade until the cutting blade reaches the modified layers after performing the modified layer forming step.

A truing device includes a housing and a truing mandrel (1) with a shaft (10) used to mount a circular tool having a concentric opening, in particular a grinding disc (3), and with a first bearing (11) fixed on the housing (4) and located in a first end region of the truing mandrel (1) The shaft (10) includes a hydraulic clamping device (20) having a chamber (21) containing hydraulic medium, to which a pre-clamping pressure can be applied with a preclamping element (23) The hydraulic clamping device is formed from a clamping section (22) lying above the chamber (21) in the radial direction and held in the shaft on both sides. The outer surface of the clamping section forms the clamping surface and which, when the hydraulic pressure in the chamber (21) increases, can be reversibly moved or bent outwards in the radial direction such that a radial clamping force can be exerted on the inner surface of the concentric opening of the circular tool penetrated by the clamping section (22). A method provides for mounting and removing a circular tool on the truing mandrel of a truing device of this kind.

When a work W rotates counterclockwise about an axis O.sub.w and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O.sub.1 and a grinding wheel (2) which rotates clockwise about an axis O.sub.2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S.sub.1 and a second stress sensor S.sub.2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.

When a work W rotates counterclockwise about an axis O.sub.w and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O.sub.1 and a grinding wheel (2) which rotates clockwise about an axis O.sub.2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S.sub.1 and a second stress sensor S.sub.2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.