A method of processing a rotatable assembly is described herein. The method includes mounting a grinding wheel on an arbor to form the rotatable assembly. The grinding wheel has a ring-structure formed from a plurality of grit particles dispersed within a metallic material. The method also includes mounting the rotatable assembly within at least one dressing machine, wherein the rotatable assembly is rotatable relative to a dressing tool within the at least one dressing machine, and shaping the grinding wheel with the dressing tool to define a final outer profile of the grinding wheel configured to machine a workpiece.

Method for the grinding of a gear wheel workpiece using a dressable worm grinding wheel, wherein the worm grinding wheel is rotationally driven about a tool axis of rotation and the gear wheel workpiece is rotationally driven about a workpiece axis of rotation, and relative movements are executed between the worm grinding wheel and gear wheel workpiece, and wherein after the execution of a dressing procedure of the worm grinding wheel, which is carried out by means of a rotationally-drivable dressing unit, the following steps are carried out: executing a relative shift movement between the worm grinding wheel and gear wheel workpiece parallel to the tool axis of rotation, executing an axially-parallel relative movement between the worm grinding wheel and gear wheel workpiece in parallel or diagonally to the workpiece axis of rotation, wherein a ratio between the shift movement and axially-parallel relative movement is specified, which is variable.

A polishing pad for chemical mechanical polishing (CMP) contains a lower polishing pad layer including a bottom surface of the polishing pad, an upper polishing pad layer including a top surface of the polishing pad, tunnels vertically spaced from the top surface of the polishing pad and from the bottom surface of the polishing pad, such that each of the tunnels laterally extends continuously to a respective opening in a peripheral sidewall of the polishing pad, and perforation holes vertically extending from the tunnels to the top surface of the polishing pad.

A polishing pad for chemical mechanical polishing (CMP) contains a lower polishing pad layer including a bottom surface of the polishing pad, an upper polishing pad layer including a top surface of the polishing pad, tunnels vertically spaced from the top surface of the polishing pad and from the bottom surface of the polishing pad, such that each of the tunnels laterally extends continuously to a respective opening in a peripheral sidewall of the polishing pad, and perforation holes vertically extending from the tunnels to the top surface of the polishing pad.

A determining tool for use in determining the shape of the tip end of a machining tool that machines a workpiece held on a table while the machining tool moves relatively to the table includes a bottom surface adapted to be held on the table and a flat slanting surface inclined to the bottom surface and oriented across a direction in which the machining tool moves relatively to the table, the flat slanting surface being adapted to be cut through by the tip end of the machining tool.

A method and a device for the fine-machining of a toothed workpiece with a toothed finishing tool (10) which meshes with the workpiece in mutual tooth engagement are, for the purpose of producing conically modified tooth flanks, designed according to the invention in such a way that in the dressing process the finishing tool (10) and the dressing tool (11) are set at a position of reduced center distance (a) that is offset from a position of maximum center distance.

There is described a method, apparatus and shaping tool for shaping a workpiece. The tool comprises a flexible support surface on which are mounted a number of rigid pellets (84) carrying abrasive material. The tool is driven, in contact with the workpiece surface (S), to perform a ductile grinding operation which results in a finished surface of reduced roughness as compared to conventional grinding operations, while achieving significantly higher material removal rates than comparable ultra-precision grinding techniques. A procedure for preparing the tool for operation by conditioning the tool against a conditioning surface is also described. An exemplary application for the method and apparatus is in the preparation of moulds for moulding curved glass components for use in display screens, in which process a silicon carbide mould cavity surface is shaped using the method to produce a mould cavity surface with a smooth surface finish.

There is described a method, apparatus and shaping tool for shaping a workpiece. The tool comprises a flexible support surface on which are mounted a number of rigid pellets (84) carrying abrasive material. The tool is driven, in contact with the workpiece surface (S), to perform a ductile grinding operation which results in a finished surface of reduced roughness as compared to conventional grinding operations, while achieving significantly higher material removal rates than comparable ultra-precision grinding techniques. A procedure for preparing the tool for operation by conditioning the tool against a conditioning surface is also described. An exemplary application for the method and apparatus is in the preparation of moulds for moulding curved glass components for use in display screens, in which process a silicon carbide mould cavity surface is shaped using the method to produce a mould cavity surface with a smooth surface finish.

A rotary dresser includes a cored bar, an electroformed layer, and superabrasive grains fixed to an outer circumferential surface of the electroformed layer, and a plurality of island regions in which a plurality of superabrasive grains is gathered is provided at certain intervals. Since a plurality of the island regions in which a plurality of the superabrasive grains is gathered is provided at certain intervals, the same degree of dressing accuracy can be obtained as in a case in which expensive large superabrasive grains are fixed at a low density using cheap and small superabrasive grains, it is possible to decrease the contact area of a single superabrasive grain, and favorable cutting quality can be obtained.

A wafer processing method includes a holding step of holding a wafer on a chuck table; a dressing step of cutting a peripheral marginal area of the wafer by a cutting blade mounted to a cutting unit to condition a state of a cutting edge; and a dividing step of cutting streets by the cutting blade mounted to the cutting unit to divide the wafer into individual device chips.