A dressing ring includes a ring-shaped dressing member for dressing a processing stone. Preferably, the dressing member has an opening in which a workpiece is arranged when the workpiece is ground. Also preferably, the dressing ring further includes a ring-shaped support plate having an upper surface on which the dressing member is fixed. In addition, a grinding method of the workpiece includes the steps of holding the ring-shaped dressing member on a holding surface of a chuck table, holding the workpiece in the opening of the dressing member such that a back surface of the workpiece is located higher than the upper surface of the dressing member, grinding the workpiece by grinding stones of a grinding wheel, and dressing the grinding stones with the dressing member on the holding surface.

A dressing ring includes a ring-shaped dressing member for dressing a processing stone. Preferably, the dressing member has an opening in which a workpiece is arranged when the workpiece is ground. Also preferably, the dressing ring further includes a ring-shaped support plate having an upper surface on which the dressing member is fixed. In addition, a grinding method of the workpiece includes the steps of holding the ring-shaped dressing member on a holding surface of a chuck table, holding the workpiece in the opening of the dressing member such that a back surface of the workpiece is located higher than the upper surface of the dressing member, grinding the workpiece by grinding stones of a grinding wheel, and dressing the grinding stones with the dressing member on the holding surface.

A high-precision turning device. The device has a base plate, a base, a support A, wherein a groove is formed in the center of the bottom surface of the base, and a lead screw passes through the groove; symmetrical T-shaped annular grooves are formed in two sides of the interior of the base, two symmetrical T-shaped annular columns are arranged on the lower end face of a turning block, and the T-shaped annular columns can be inserted into the T-shaped annular grooves; and the structure of a central position of the lower end face of the turning block is annular teeth, and the annular teeth are meshed with the lead screw. A servomotor drives the lead screw to rotate, and by virtue of meshing matching of the annular teeth and the lead screw, the turning block can turn along the centers of the T-shaped annular grooves in the base.

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

In various implementations, a conditioning head may include a substrate and a plurality of protrusions extending from a surface of the substrate. The plurality of protrusions be arranged on the substrate surface in a plurality of sinusoidal wave patterns. For example, the plurality of protrusions may be arranged in an array of offset sinusoidal wave patterns. In some implementations, a conditioning head may include a macro design in which one or more portions include protrusions and one or more portions do not include protrusions.

In various implementations, a conditioning head may include a substrate and a plurality of protrusions extending from a surface of the substrate. The plurality of protrusions be arranged on the substrate surface in a plurality of sinusoidal wave patterns. For example, the plurality of protrusions may be arranged in an array of offset sinusoidal wave patterns. In some implementations, a conditioning head may include a macro design in which one or more portions include protrusions and one or more portions do not include protrusions.

Provided is a dressing device for a carrier. The dressing device comprises a dresser, a swing arm, a base and at least one damper. A first end and a second end of the swing arm are coupled to the dresser and the base, respectively, and the at least one damper is disposed inside the swing arm. Any axial vibration of the dresser or the swing arm during dressing for the carrier can be compensated or attenuated by the damper in an active manner properly, so as to make the surface of the carrier flatter and more uniform, which not only improves a removal rate of material and a polishing result of the surface in the subsequent chemical mechanical planarization process, but also prolongs the service life of the carrier. The present disclosure further relates to a polishing system for dressing the carrier by using the said dressing device.