A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal. The controller is a processor and the instructions are stored on a non-transitory com-puter-readable medium and executed by the processor.

A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc placement device configured to automatically: remove the first abrasive disc from the liner, transport the first abrasive disc to a robotic tool of the robotic defect repair system, and place the first abrasive disc on a backup pad coupled to the robotic tool. The system also includes an abrasive disc remover configured to automatically remove the first abrasive disc after receiving a removal signal. The system also includes a controller configured to send an instruction to the disc placement device to remove, transport and place the first abrasive disc, instruct the robotic tool to conduct an abrasive operation. The controller is also configured to send the removal signal. The controller is a processor and the instructions are stored on a non-transitory com-puter-readable medium and executed by the processor.

A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.

A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.

A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device. A device for dispensing solid compound pastes for surface treatment to a machining tool comprises a heating device that is arranged to heat a solid compound paste for surface treatment that contains abrasives, wherein at least a partial amount of the solid compound paste is arranged to be softened by supplying thermal energy, a conveyor device having a pump unit comprising at least one pump and at least one conveyor path for the softened solid compound paste, wherein the pump is arranged for conveying abrasive media, and a dosing device arranged for applying the softened solid compound paste to a machining tool.

A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device. A device for dispensing solid compound pastes for surface treatment to a machining tool comprises a heating device that is arranged to heat a solid compound paste for surface treatment that contains abrasives, wherein at least a partial amount of the solid compound paste is arranged to be softened by supplying thermal energy, a conveyor device having a pump unit comprising at least one pump and at least one conveyor path for the softened solid compound paste, wherein the pump is arranged for conveying abrasive media, and a dosing device arranged for applying the softened solid compound paste to a machining tool.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.

Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.