A creep feed grinding apparatus includes a chuck table, a grinding unit having a spindle and a grinding wheel mounted on a lower end of the spindle, the grinding wheel including a plurality of grindstones disposed in an annular array on a surface of an annular base, the grindstones following an annular track upon rotation of the spindle, a moving mechanism for moving the chuck table and the grinding unit relative to each other along a predetermined direction perpendicular to the longitudinal axis of the spindle, and a bottom surface state adjusting mechanism for adjusting states of bottom surfaces of the grindstones by cleaning and/or correcting the bottom surfaces of the grindstones. The bottom surface state adjusting mechanism is positioned outside of a relative movement area of the chick table in which the chuck table and the grinding unit are moved relative to each other by the moving mechanism.

A creep feed grinding apparatus includes a chuck table, a grinding unit having a spindle and a grinding wheel mounted on a lower end of the spindle, the grinding wheel including a plurality of grindstones disposed in an annular array on a surface of an annular base, the grindstones following an annular track upon rotation of the spindle, a moving mechanism for moving the chuck table and the grinding unit relative to each other along a predetermined direction perpendicular to the longitudinal axis of the spindle, and a bottom surface state adjusting mechanism for adjusting states of bottom surfaces of the grindstones by cleaning and/or correcting the bottom surfaces of the grindstones. The bottom surface state adjusting mechanism is positioned outside of a relative movement area of the chick table in which the chuck table and the grinding unit are moved relative to each other by the moving mechanism.

A manufacturing method for a substrate wafer, including: a wafer having a first and second main surface; forming a flattening resin layer on second main surface; with the flattening resin layer adsorbed and held as a reference surface, grinding or polishing first main surface as a first processing; removing flattening resin layer from the wafer; with the wafer's first main surface subjected to the first processing adsorbed and held, grinding or polishing second main surface as a second processing; with the second main surface subjected to second processing adsorbed and held, further grinding or polishing first main surface as a third processing; with first main surface subjected to third processing adsorbed and held, further grinding or polishing second main surface as a fourth processing to obtain a substrate wafer, wherein first processing and/or third processing is executed such that the wafer has a central concave or central convex thickness distribution.

A manufacturing method for a substrate wafer, including: a wafer having a first and second main surface; forming a flattening resin layer on second main surface; with the flattening resin layer adsorbed and held as a reference surface, grinding or polishing first main surface as a first processing; removing flattening resin layer from the wafer; with the wafer's first main surface subjected to the first processing adsorbed and held, grinding or polishing second main surface as a second processing; with the second main surface subjected to second processing adsorbed and held, further grinding or polishing first main surface as a third processing; with first main surface subjected to third processing adsorbed and held, further grinding or polishing second main surface as a fourth processing to obtain a substrate wafer, wherein first processing and/or third processing is executed such that the wafer has a central concave or central convex thickness distribution.

A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate. The lower cup is provided with a discharge opening through which the processing residue is discharged.

An electric tool includes an output member, a motor, and a housing. The motor includes a rotor shaft, a rotor core, and a stator component. The rotor shaft is configured to rotate around a first axis. The stator component includes a coil winding. The stator component surrounds the first axis to separate the accommodation cavity into a first space and a second space. The first space includes a first end and a second end. The motor further includes a first end cover and a second end cover. The first end cover is disposed at the first end of the first space. The second end cover is disposed at the second end of the first space. A passage is formed between the second end cover and a structure surrounding the first space, and the passage is configured to place the first space into communication with the second space.

The present disclosure relates to a grinding sander. The grinding sander includes a sanding plate configured to move in an operation state, and a plurality of limiting members disposed on a surface of the sanding plate to define a plurality of strip-shaped slot areas. Each strip-shaped slot area is configured to allow at least one strip-shaped sandpaper to be correspondingly mounted therein to effect sanding of a surface of an article via the strip-shaped sandpaper under the movement of the sanding plate. The grinding sander of the present disclosure may be used to perform high-quality sanding of a narrow surface of an article.

The present disclosure relates to a grinding sander. The grinding sander includes a sanding plate configured to move in an operation state, and a plurality of limiting members disposed on a surface of the sanding plate to define a plurality of strip-shaped slot areas. Each strip-shaped slot area is configured to allow at least one strip-shaped sandpaper to be correspondingly mounted therein to effect sanding of a surface of an article via the strip-shaped sandpaper under the movement of the sanding plate. The grinding sander of the present disclosure may be used to perform high-quality sanding of a narrow surface of an article.

One array of grindstones is used for in-feed grinding and creep-feed grinding. Therefore, it is not necessary to position a chuck table that is holding a plate-shaped workpiece with respect to two different arrays of grindstones. As a result, a period of time required to grind the plate-shaped workpiece can be shortened. Furthermore, lower surfaces of the grindstones are used for the in-feed grinding, whereas side surfaces of the grindstones are used for the creep-feed grinding. Consequently, the amount by which the grindstones are worn can be smaller than that in a case where the plate-shaped workpiece is ground to a predetermined thickness in only the in-feed grinding or the creep-feed grinding.

One array of grindstones is used for in-feed grinding and creep-feed grinding. Therefore, it is not necessary to position a chuck table that is holding a plate-shaped workpiece with respect to two different arrays of grindstones. As a result, a period of time required to grind the plate-shaped workpiece can be shortened. Furthermore, lower surfaces of the grindstones are used for the in-feed grinding, whereas side surfaces of the grindstones are used for the creep-feed grinding. Consequently, the amount by which the grindstones are worn can be smaller than that in a case where the plate-shaped workpiece is ground to a predetermined thickness in only the in-feed grinding or the creep-feed grinding.