A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

The present utility model provides a cutter sharpener including a housing, a height adjusting mechanism and a cutter clamping mechanism mounted on the housing, and a grinding mechanism rotatably connected to the height adjusting mechanism. The housing includes a first mounting location, the height adjusting mechanism is movably connected to the first mounting location, the height adjusting mechanism includes a lifting body, and the lifting body can move up and down relative to the first mounting location. The cutter sharpener further includes a degree indicating mechanism fixedly connected to the lifting body.

Multiple holding surfaces of a chuck table are disposed in such a manner that the heights thereof from a reference surface are in increasing order along a first direction parallel to each of them. Thus, in a case of using this chuck table, creep-feed grinding for workpieces each held by a respective one of the multiple holding surfaces can be executed in states in which a grinding unit is positioned at different heights. In this case, the workpiece for which the creep-feed grinding has been executed is located on the lower side as viewed from the grinding unit when another workpiece is ground. Due to this, in this creep-feed grinding, a specific workpiece can be prevented from being ground twice.

Multiple holding surfaces of a chuck table are disposed in such a manner that the heights thereof from a reference surface are in increasing order along a first direction parallel to each of them. Thus, in a case of using this chuck table, creep-feed grinding for workpieces each held by a respective one of the multiple holding surfaces can be executed in states in which a grinding unit is positioned at different heights. In this case, the workpiece for which the creep-feed grinding has been executed is located on the lower side as viewed from the grinding unit when another workpiece is ground. Due to this, in this creep-feed grinding, a specific workpiece can be prevented from being ground twice.

An apparatus for machining flat workpieces has a machine frame including a workpiece support and at least one carrier unit positionable relative to the workpiece support The apparatus has a first and at least a second machining head, each machining head being connected to the carrier unit and each machining head comprising a tool carrier that is mounted rotatably about a first axis perpendicular to the workpiece support and that carries at least one tool that is mounted on the tool carrier eccentrically to the first axis rotatably about a second axis perpendicular to the workpiece support and is connected to a planet wheel that is gear-engaged with a sun wheel that is coaxial to the first axis. The tool carriers of the machining heads are drivable by at least a first drive unit The tool carrier of the first machining head is arranged such that it is movable in a shifting range (V1) along the first axis relative to the carrier unit Further, the tool carrier of the second machining head is arranged such that it is movable in a shifting area (V2) along the first axis relative to the carrier unit

A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.

Stored is a height of a grinding mechanism when lower surfaces of grinding stones have come into contact with an upper surface of a wafer held on a holding surface, through lowering of the grinding mechanism from above the wafer. Based on this height, an origin point height which is a height of the grinding mechanism when the lower surfaces of the grinding stones have come into contact with the holding surface is then determined.

A dedusting device, such as for a sander, for dedusting particles from a narrow edge of a workpiece has a nozzle device designed to remove the particles from the edge with a blasting fluid. The nozzle device has at least one nozzle outlet opening through which the blasting fluid emerges for dedusting in a blasting region. An exhaust air device designed to extract by suction the particles removed from the narrow edge of the workpiece (has at least one exhaust air inlet opening through which a blasting fluid containing particles enters. A supporting device which, in the operating state, is used for the workpiece to bear against. The supporting device is arranged between the nozzle device and the exhaust air device.

A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.

A floor leveling apparatus and method for cutting parallel grooves in a hardened body which is configured to assist in utilizing a grinder to finish surfaces in a planar manner.