Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.

A work piece processing system includes a grinding wheel (12) configured to remove material from a work piece in a grinding process. The grinding wheel (12) includes a conductive layer (122) surrounding a rotation axis of the grinding wheel (12) and a number of grinding members (123) positioned at an outer surface of the conductive layer (122). The system also includes a holding module (20) and an electrolyte supply line (365). In addition, the system includes an actuator assembly (30) for driving a rotation of the grinding wheel (12) and a rotation of the holding module (20), and a power supply module (45) to apply current to the conductive layer (122) and the holding module (20). The work piece processing system uses electrochemical removal to reduce grinding damage and improve machining efficiency. A work piece processing method is also provided.

A work piece processing system includes a grinding wheel (12) configured to remove material from a work piece in a grinding process. The grinding wheel (12) includes a conductive layer (122) surrounding a rotation axis of the grinding wheel (12) and a number of grinding members (123) positioned at an outer surface of the conductive layer (122). The system also includes a holding module (20) and an electrolyte supply line (365). In addition, the system includes an actuator assembly (30) for driving a rotation of the grinding wheel (12) and a rotation of the holding module (20), and a power supply module (45) to apply current to the conductive layer (122) and the holding module (20). The work piece processing system uses electrochemical removal to reduce grinding damage and improve machining efficiency. A work piece processing method is also provided.

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.

A method for processing a substrate includes forming, in a state where the substrate and a film are integrated through a resin that cures due to an external stimulus, a laminate by semi-curing the resin by applying the external stimulus to the resin; processing the laminate; improving a curing degree of the resin by applying the external stimulus to the resin after processing of the laminate; and peeling the resin and the film from the substrate after improving of the curing degree.

A method for processing a substrate includes forming, in a state where the substrate and a film are integrated through a resin that cures due to an external stimulus, a laminate by semi-curing the resin by applying the external stimulus to the resin; processing the laminate; improving a curing degree of the resin by applying the external stimulus to the resin after processing of the laminate; and peeling the resin and the film from the substrate after improving of the curing degree.