When decoating a glass panel (3), a decoating tool (6) with a circular-cylindrical grinding element (8) is used, which element is set to rotate around its axis. In the end face of the grinding element (8) that is used when the active face (9) is decoated, a hole (10) and at least one radial groove (11) are provided. The decoating tool (6) is placed at a spot (A) on the glass panel (3) in a movement (arrow 13) that is oriented at an acute angle to the plane of the glass panel (3), which lies between the ends (B) and (C) of the strip-shaped decoating area (14) and moves first to the one end (B) (arrow 15) and then to the other end (C) (arrow 16) in order to strip coating from the glass panel (3) in the decoating area (14).

A method for producing reinforced glass, reinforced glass and an electronic device are provided. The method for producing reinforced glass includes: subjecting glass to a first reinforcing treatment; detecting a first stress parameter of the glass subjected to the first reinforcing treatment, and determining whether the glass subjected to the first reinforcing treatment is qualified according to the first stress parameter; subjecting the glass to a second reinforcing treatment when the glass subjected to the first reinforcing treatment is qualified; detecting a second stress parameter of the glass subjected to the second reinforcing treatment, and determining whether the glass subjected to the second reinforcing treatment is qualified according to the second stress parameter; and subjecting the glass to a touch-polishing treatment when the glass subjected to the second reinforcing treatment is qualified, so as to obtain the reinforced glass.

A synthetic quartz glass substrate is prepared by immersing a starting substrate in an aqueous solution of a nonionic surfactant and precision polishing the substrate with a colloidal silica water dispersion. A synthetic quartz glass substrate having a few defects and low surface roughness is obtained while the polishing rate is improved and the polishing time is reduced.

A display device includes first and second substrates each including a short side and a long side, ground parts located on at least one of the short and long sides of each of the first and second substrates and including at least one first ground surfaces, which are perpendicular to opposing surfaces of the first and second substrates, and at least one second ground surfaces, which are provided at at least one edge of the second substrate to define an obtuse angle with reference to the first ground surfaces, and unevenness disposed on the first ground surfaces along a first direction, where the unevenness defines an acute angle with reference to a normal line to the opposing surfaces.

A display device includes first and second substrates each including a short side and a long side, ground parts located on at least one of the short and long sides of each of the first and second substrates and including at least one first ground surfaces, which are perpendicular to opposing surfaces of the first and second substrates, and at least one second ground surfaces, which are provided at at least one edge of the second substrate to define an obtuse angle with reference to the first ground surfaces, and unevenness disposed on the first ground surfaces along a first direction, where the unevenness defines an acute angle with reference to a normal line to the opposing surfaces.

A method of producing a carrier for use in a double-side polishing apparatus, the method including engaging an insert with a holding hole formed in a carrier body and sticking the insert to the holding hole, the carrier body being configured to be disposed between upper and lower turn tables to which polishing pads are attached of the double-side polishing apparatus, the holding hole being configured to hold a wafer during polishing, the insert being configured to contact an edge of the wafer to be held, the method including: performing a lapping process and a polishing process on the insert; engaging the insert subjected to the lapping process and the polishing process with the holding hole of the carrier body; and sticking and drying the engaged insert while applying a load to the insert in a direction perpendicular to main surfaces of the carrier body.

An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

A display device includes first and second substrates each including a short side and a long side, ground parts located on at least one of the short and long sides of each of the first and second substrates and including at least one first ground surfaces, which are perpendicular to opposing surfaces of the first and second substrates, and at least one second ground surfaces, which are provided at at least one edge of the second substrate to define an obtuse angle with reference to the first ground surfaces, and unevenness disposed on the first ground surfaces along a first direction, where the unevenness defines an acute angle with reference to a normal line to the opposing surfaces.

A display device includes first and second substrates each including a short side and a long side, ground parts located on at least one of the short and long sides of each of the first and second substrates and including at least one first ground surfaces, which are perpendicular to opposing surfaces of the first and second substrates, and at least one second ground surfaces, which are provided at at least one edge of the second substrate to define an obtuse angle with reference to the first ground surfaces, and unevenness disposed on the first ground surfaces along a first direction, where the unevenness defines an acute angle with reference to a normal line to the opposing surfaces.

A wafer grinding method includes a step of holding a wafer on a holding surface of a chuck table, a first grinding step of controlling a grinding feeding mechanism by a control unit so as to increase or decrease a load value measured by a load measuring unit and grinding the wafer to a thickness not reaching a predetermined finished thickness of the wafer, and a second grinding step of imparting a preset load value and grinding the wafer until the predetermined finished thickness is reached, after the first grinding step.