A treatment machine for adjusting a K factor of a cutting edge of a worktool is described. In an embodiment the treatment machine comprises: a blast gun for directing a pressurised blast stream of abrasive particles in a blast direction; mounting means for securing the worktool such that a rotational axis of the worktool is radially offset from the blast direction by an offset distance, and wherein control of the offset distance between the blast direction and the rotational axis adjusts the K factor of the cutting edge.

A treatment machine for adjusting a K factor of a cutting edge of a worktool is described. In an embodiment the treatment machine comprises: a blast gun for directing a pressurised blast stream of abrasive particles in a blast direction; mounting means for securing the worktool such that a rotational axis of the worktool is radially offset from the blast direction by an offset distance, and wherein control of the offset distance between the blast direction and the rotational axis adjusts the K factor of the cutting edge.

The peening apparatus includes a processing tank, a table, a moving unit including a nozzle moving device, a quill, a first head having a mounting hole and disposed at a distal end of the quill, a motor and a first spindle exposed from the mounting hole, a nozzle head portion separable from the moving unit and including a second head having a connection port connected to the mounting hole, a connecting shaft connected to the first spindle, a second spindle, a nozzle disposed below the second spindle, a nozzle flow path penetrating inside the second spindle and connected to the nozzle to be opened to an upper end of the second spindle, and a swivel joint disposed at an upper end portion of the second spindle and connected to the nozzle flow path.

The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, the polishing machine comprising a polishing disk (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for receiving an abrasive, a positioning device (17) for relative positioning of the polishing disk and of the polishing platform between a polishing position and a set-up position (16), and a drive device for executing a relative polishing movement between the polishing platform and the polishing disk in the polishing position, wherein the polishing machine has a cleaning device for applying dry ice to the polishing platform and/or to the polishing disk.

An elastic abrasive with abrasive grains dispersed in or adhered to an elastic base material is ejected toward a side portion of a substrate together with compressed air. The elastic abrasive is ejected toward a predetermined processing area centered on a processing point in an ejection direction that intersects a widthwise line at the processing point and that forms a predetermined inclination angle selected from a range of 2° to 60° relative to a contact line. Moreover, an ejection nozzle and the workpiece are moved relatively to each other so that the processing area is moved at a fixed speed in a circumferential direction of the workpiece and so that the ejection direction is maintained at each processing point after moving. If multiple stacked substrates are to be processed, the processing area is moved at a fixed speed also in a widthwise direction of the substrates.

A shot treatment apparatus and a shot treatment method applicable to the mass production of a wide range of products. A shot treatment apparatus, comprising: a spinning table which has a first rotary shaft and which holds and rotates a workpiece; an ejection apparatus that ejects a shot media from a nozzle to the workpiece; a cabinet having a treatment chamber formed therein; and a control apparatus comprising a first control unit that controls the ejection apparatus, the nozzle being held so as to be positionable and three-dimensionally swingable with respect to the workpiece.

A shot treatment apparatus and a shot treatment method applicable to the mass production of a wide range of products. A shot treatment apparatus, comprising: a spinning table which has a first rotary shaft and which holds and rotates a workpiece; an ejection apparatus that ejects a shot media from a nozzle to the workpiece; a cabinet having a treatment chamber formed therein; and a control apparatus comprising a first control unit that controls the ejection apparatus, the nozzle being held so as to be positionable and three-dimensionally swingable with respect to the workpiece.

Fluid jet cutting systems, components and related methods for generating relatively low load abrasive fluid jets that are particularly well suited for cutting fragile, brittle or otherwise sensitive materials are provided. An example method includes supplying fluid at an operating pressure of at least 60,000 psi to an orifice having a circular cross-sectional profile with a diameter that is less than or equal to 0.010 inches to create a fluid jet that leaves a fluid jet cutting head through a jet passageway having a circular cross-sectional profile with a diameter that is less than or equal to 0.015 inches.

Fluid jet cutting systems, components and related methods for generating relatively low load abrasive fluid jets that are particularly well suited for cutting fragile, brittle or otherwise sensitive materials are provided. An example method includes supplying fluid at an operating pressure of at least 60,000 psi to an orifice having a circular cross-sectional profile with a diameter that is less than or equal to 0.010 inches to create a fluid jet that leaves a fluid jet cutting head through a jet passageway having a circular cross-sectional profile with a diameter that is less than or equal to 0.015 inches.

A shot treatment device includes, a rotary table rotatable in a first rotation direction about a first rotation shaft extending along a vertical direction, a plurality of placement tables arranged at intervals in a circumferential direction on an upper surface of the rotary table, an ejector configured to eject shot media, a first inspection detector configured to inspect surface properties of a workpiece, a shot chamber in which shot media is ejected to a workpiece, and a first inspection chamber provided downstream in the first rotation direction from the shot chamber. The ejector ejects shot media to a workpiece held on a first placement table that has entered the shot chamber, and the first inspection detector capable of ascending and descending is disposed above a second placement table that has entered the first inspection chamber and inspects surface properties of a workpiece held on the second placement table.