A polishing pad including a damping layer made of a resilient material including expanded semi-rigid polyurethane having a microcell structure, an adhesive layer including a layer of a hook-and-loop fastener adapted to interact and connect to a corresponding layer of the hook-and-loop fastener located at a bottom surface of the working element of the machine tool and a polishing layer including microfiber adapted for polishing a surface of a work piece. The polishing layer includes a fabric having a woven mesh of microfibers that define a back side of the polishing layer. The fabric serves as a barrier to the resilient material of the damping layer such that the resilient material does not reach an active side of the polishing layer comprising the microfibers when the damping layer, adhesive layer and polishing layer are combined, and such that the active side of the polishing layer is free of resilient material of the damping layer.

A method for manufacturing a polishing pad for a hand tool having a working element performing an orbital, random orbital, and/or a rotational movement, the polishing pad having attached layers including: a resilient damping layer, an adhesive layer for connection to a corresponding layer located at a bottom surface of the working element, and a polishing layer including microfiber for polishing a surface of a work piece. The method includes the steps of: providing a casting mold having a recess corresponding to form of the polishing pad and a lid for closing the recess; placing the adhesive layer into the recess; pouring the resilient material for the damping layer into the recess on top of the adhesive layer; placing the polishing layer on the resilient material; closing the recess with the lid; and manufacturing the polishing pad under external heat supply until the resilient material is cured.

A polishing or grinding pad with a multilayer reinforcement is provided. In one aspect, a floor polishing or grinding pad assembly employs a flexible pad, at least two reinforcement layers or rings with different characteristics, and multiple floor-contacting tools such as abrasive disks. In another aspect, a workpiece polishing or grinding pad assembly includes a flexible and rotatable pad, a polymeric reinforcement layer coupled to the pad and a metallic reinforcement layer to which are coupled abrasive tools. In yet another aspect, a floor-facing reinforcement is more flexible than a pad-facing reinforcement which is more rigid.

Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine the size and form required for a tool to apply shaping treatment to all parts of the workpiece surface. Measurements of the actual workpiece are then compared with data relating to the required workpiece form, to determine the amount and distribution of material to be removed from the workpiece. A tool path for moving the tool over the workpiece to achieve the required shaping operation is then determined, and the tool and tool path data are provided to a shaping machine to carry out the shaping operation. The shaping tool may comprise an elastomeric body covered in a flexible cloth on which rigid pellets containing abrasive material are fixed. The specification discloses methods of manufacturing such tools, and also discloses methods for conditioning the pelleted cloth. There is also described a method of determining permissible amounts of tool offset to ensure smooth cutting of the workpiece.

A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.

A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.

There is described a method, apparatus and shaping tool for shaping a workpiece. The tool comprises a flexible support surface on which are mounted a number of rigid pellets (84) carrying abrasive material. The tool is driven, in contact with the workpiece surface (S), to perform a ductile grinding operation which results in a finished surface of reduced roughness as compared to conventional grinding operations, while achieving significantly higher material removal rates than comparable ultra-precision grinding techniques. A procedure for preparing the tool for operation by conditioning the tool against a conditioning surface is also described. An exemplary application for the method and apparatus is in the preparation of moulds for moulding curved glass components for use in display screens, in which process a silicon carbide mould cavity surface is shaped using the method to produce a mould cavity surface with a smooth surface finish.

The tool includes a base including a rigid carrier and a flexible collar encircling the rigid carrier; an elastically compressible interface; and a flexible buffer including a central portion that is located in line with the rigid carrier and a peripheral portion that is located transversely therebeyond. This peripheral portion is connected to the carrier exclusively via the interface and via the collar, wherein the collar is configured so that the tool is elastically deformable between a rest position that it adopts in the absence of stress and a reference position in which the transverse end second surface of the flexible buffer is pressed against a reference surface that is spherical and of radius included between 40 mm and 1500 mm.

The tool includes a base including a rigid carrier and a flexible collar encircling the rigid carrier; an elastically compressible interface; and a flexible buffer including a central portion that is located in line with the rigid carrier and a peripheral portion that is located transversely therebeyond. This peripheral portion is connected to the carrier exclusively via the interface and via the collar, wherein the collar is configured so that the tool is elastically deformable between a rest position that it adopts in the absence of stress and a reference position in which the transverse end second surface of the flexible buffer is pressed against a reference surface that is spherical and of radius included between 40 mm and 1500 mm.

Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine the size and form required for a tool to apply shaping treatment to all parts of the workpiece surface. Measurements of the actual workpiece are then compared with data relating to the required workpiece form, to determine the amount and distribution of material to be removed from the workpiece. A tool path for moving the tool over the workpiece to achieve the required shaping operation is then determined, and the tool and tool path data are provided to a shaping machine to carry out the shaping operation. The shaping tool may comprise an elastomeric body covered in a flexible cloth on which rigid pellets containing abrasive material are fixed. The specification discloses methods of manufacturing such tools, and also discloses methods for conditioning the pelleted cloth. There is also described a method of determining permissible amounts of tool offset to ensure smooth cutting of the workpiece.