Disclosed herein are a method of fabricating sandpaper for grinding industrial parts and sandpaper fabricated by the method. The method includes: a cutting step of cutting sandpaper to a set length; a cutoff hole formation step of forming a plurality of cutoff holes in one side periphery of the sandpaper in a lengthwise direction; a winding step of forming a roll of sandpaper by winding the sandpaper around one side of a spindle; a taping step of temporarily fastening the roll of sandpaper by winding tape; a bonding step of securely fastening the one side of the roll of sandpaper by applying bond to a side surface of the roll of sandpaper; and a drying step of drying the bond for a set time. In the sandpaper, a plurality of cutoff holes is formed in one side periphery of the sandpaper in a lengthwise direction.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

Object: Provided are an abrasive roll capable of easily improving abrasiveness and a method for manufacturing an abrasive roll. Solution: An abrasive roll (1) includes a core member (12) extending in the axial direction and an abrasive part (13) including a sheet (14) member of non-woven fabric wound a plurality of times around the core member (13), wherein a plurality of perforations (16) penetrating in the thickness direction of the sheet member (14) are formed in the sheet member (14).

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

Disclosed herein are a method of fabricating sandpaper for grinding industrial parts and sandpaper fabricated by the method. The method includes: a cutting step of cutting sandpaper to a set length; a cutoff hole formation step of forming a plurality of cutoff holes in one side periphery of the sandpaper in a lengthwise direction; a winding step of forming a roll of sandpaper by winding the sandpaper around one side of a spindle; a taping step of temporarily fastening the roll of sandpaper by winding tape; a bonding step of securely fastening the one side of the roll of sandpaper by applying bond to a side surface of the roll of sandpaper; and a drying step of drying the bond for a set time. In the sandpaper, a plurality of cutoff holes is formed in one side periphery of the sandpaper in a lengthwise direction.

A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.