A method of aligning abrasive particles on a substrate. The method comprises providing a substrate. The method also comprises providing abrasive particles. The method also comprises generating a modulated electrostatic field. The modulated electrostatic field is configured to have a first effective direction at a first time and a second effective direction at a second time. The electrostatic field is configured to cause the abrasive particles to align rotationally in both a z-direction and a y-direction.

The present application relates to a composite binding agent grinding wheel, wherein a weight percentage of each raw material of the grinding wheel is: 45-65% of pretreatment abrasive, 8-20% of resin bonding agent, 5-12% of hexagonal boron nitride, 5-10% of silicon dioxide, 5-15% of ceramic powder, 6-12% of prealloy powder bonding agent, and 1-3% of boron powder. The composite binding agent super-hard grinding wheel prepared by the present application can achieve nano-level grinding surface quality when grinding epitaxial wafers, and the grinding wheel has strong self-sharpening and high sharpness. It has obvious advantages in the finishing of silicon carbide crystal epitaxial wafers, which can solve the current limitations of back thinning processing of silicon carbide crystal epitaxial wafers.

A cutting element may include a substrate and a volume of polycrystalline diamond material affixed to the substrate at an interface. The volume of polycrystalline diamond may include a front cutting face with at least one substantially planar portion and at least one recess. The at least one recess may extend from a plane defined by the at least one substantially planar portion a first depth into the volume of polycrystalline diamond material in an axial direction parallel to a central axis of the cutting element. The volume of polycrystalline diamond material may comprise a region including a catalyst material. At least one region substantially free of the catalyst material may extend from the at least one substantially planar portion of the front cutting face a second depth into the volume of polycrystalline diamond in the axial direction. Methods of forming cutting elements.

An abrasive tool can include a bonded abrasive including a body and a barrier layer bonded to a major surface of the body. The body can include abrasive particles contained within a bond material. The barrier material can include a metal-containing film. In an embodiment, the barrier layer may further include a polymer-containing film. In another embodiment, the barrier layer may include a biaxially oriented material. The abrasive tool may be formed such that the barrier layer is formed in-situ with the formation of the bonded abrasive.

A method of processing a superabrasive element includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode such that a voltage is generated between the polycrystalline diamond table and the electrode and the voltage is applied to the processing solution.

A polycrystalline diamond element leaching assembly includes a polycrystalline diamond element, a protective leaching cup surrounding at least a portion of the polycrystalline diamond element, and a protective layer positioned between the polycrystalline diamond element and the protective leaching cup. A method of processing a polycrystalline diamond element includes covering a selected portion of a polycrystalline diamond element with a curable resin layer, curing the curable resin layer to form a protective layer, and exposing at least a portion of the polycrystalline diamond element to a leaching agent. Another method of processing a polycrystalline diamond element includes depositing a curable resin within a protective leaching cup and positioning a polycrystalline diamond element within the protective leaching cup such that the curable resin is displaced so as to surround at least a portion of the polycrystalline diamond element.

Superabrasive elements may be produced by method includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode.

A method of processing a superabrasive element includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode such that a voltage is generated between the polycrystalline diamond table and the electrode and the voltage is applied to the processing solution. The method includes the use of an improved processing solution, including an organic acid and a divalent (e.g., Group II) metal salt, to increase the leaching depth.

A multiphase abrasive particle precursor is disclosed. The precursor includes a first phase of a first material with a substantially constant first composition throughout the first phase. The precursor also includes a second phase, of a second material, with a substantially constant composition throughout the second phase. The precursor includes an interface between the first and second phases. The multiphase abrasive particle precursor is a shaped abrasive particle precursor.

A method of processing a polycrystalline diamond element includes forming a protective layer over a selected portion of a polycrystalline diamond element, the polycrystalline diamond element having a polycrystalline diamond table that includes a superabrasive face, a superabrasive side surface, and a chamfer extending between the superabrasive face and the superabrasive side surface. A portion of the superabrasive side surface is covered by the protective layer and the protective layer is not formed over the chamfer. The method includes exposing at least a portion of the polycrystalline diamond element to a leaching solution. A polycrystalline diamond element has a polycrystalline diamond table that includes a leached volume extending from the superabrasive face to a portion of the chamfer proximate to the superabrasive side surface, and the leached volume does not substantially extend along the superabrasive side surface.