A bonded abrasive article comprises a plurality of abrasive particles, each particle having a coating of a catechol-like polymer resin on one side. The bonded abrasive article also comprises a phenolic resin binder that forms a bonded abrasive matrix of the bonded abrasive article. The plurality of abrasive particles are retained in the phenolic binder.

A bonded abrasive article comprises a plurality of abrasive particles, each particle having a coating of a catechol-like polymer resin on one side. The bonded abrasive article also comprises a phenolic resin binder that forms a bonded abrasive matrix of the bonded abrasive article. The plurality of abrasive particles are retained in the phenolic binder.

A polishing pad comprising a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated, and having a cross section cut in a surface direction of the knitted fabric, as a polishing surface.

A polishing pad comprising a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated, and having a cross section cut in a surface direction of the knitted fabric, as a polishing surface.

A fixed abrasive three-dimensional plate includes micron size diamond beads or a mixture of abrasive particles and metal oxide beads, ranging in size from a few microns to a few tens of microns, incorporated into a matrix of one or more inorganic binders and fillers. The composition is formed into a rigid plate blank, and the abrasive plate is mounted on a substrate forming a lapping/polishing plate. The abrasive plate is capable of delivering high material removal rates coupled with reduced surface roughness when lapping/polishing advanced materials, including sapphire, titanium carbide reinforced alumina, silicon carbide, gallium nitride, aluminum nitride, zinc selenide, and other compound semiconductor materials, as well as, glass, ceramic, metallic, and composite workpieces. The diamond beads incorporated in the fixed abrasive three-dimensional plate include diamond particles ranging in size from a few nanometers to a few tens of microns, bonded with one or more inorganic binders and additives.

A fixed abrasive three-dimensional plate includes micron size diamond beads or a mixture of abrasive particles and metal oxide beads, ranging in size from a few microns to a few tens of microns, incorporated into a matrix of one or more inorganic binders and fillers. The composition is formed into a rigid plate blank, and the abrasive plate is mounted on a substrate forming a lapping/polishing plate. The abrasive plate is capable of delivering high material removal rates coupled with reduced surface roughness when lapping/polishing advanced materials, including sapphire, titanium carbide reinforced alumina, silicon carbide, gallium nitride, aluminum nitride, zinc selenide, and other compound semiconductor materials, as well as, glass, ceramic, metallic, and composite workpieces. The diamond beads incorporated in the fixed abrasive three-dimensional plate include diamond particles ranging in size from a few nanometers to a few tens of microns, bonded with one or more inorganic binders and additives.

The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.

An abrasive article including: a backing layer including a front fill overlying a backing, wherein the backing layer including the front fill comprises (1) a surface roughness of not greater than 100 microns or (2) an average thickness/roughness ratio of greater than 0.80; a make coat overlying the backing layer; and a plurality of abrasive particles overlying the backing layer, wherein at least 65% of the abrasive particles have a well-oriented tilt orientation.