The present application relates to a composite binding agent grinding wheel, wherein a weight percentage of each raw material of the grinding wheel is: 45-65% of pretreatment abrasive, 8-20% of resin bonding agent, 5-12% of hexagonal boron nitride, 5-10% of silicon dioxide, 5-15% of ceramic powder, 6-12% of prealloy powder bonding agent, and 1-3% of boron powder. The composite binding agent super-hard grinding wheel prepared by the present application can achieve nano-level grinding surface quality when grinding epitaxial wafers, and the grinding wheel has strong self-sharpening and high sharpness. It has obvious advantages in the finishing of silicon carbide crystal epitaxial wafers, which can solve the current limitations of back thinning processing of silicon carbide crystal epitaxial wafers.

The present application relates to a composite binding agent grinding wheel, wherein a weight percentage of each raw material of the grinding wheel is: 45-65% of pretreatment abrasive, 8-20% of resin bonding agent, 5-12% of hexagonal boron nitride, 5-10% of silicon dioxide, 5-15% of ceramic powder, 6-12% of prealloy powder bonding agent, and 1-3% of boron powder. The composite binding agent super-hard grinding wheel prepared by the present application can achieve nano-level grinding surface quality when grinding epitaxial wafers, and the grinding wheel has strong self-sharpening and high sharpness. It has obvious advantages in the finishing of silicon carbide crystal epitaxial wafers, which can solve the current limitations of back thinning processing of silicon carbide crystal epitaxial wafers.

A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.

An abrasive article can include a body including agglomerated first abrasive particles and unagglomerated second abrasive particles contained in a bond material. The first abrasive particles can include chromium oxide. The second abrasive particles can be elongated. The bond material can include an inorganic material including a vitreous phase.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

The disclosure is generally directed to a method of manufacturing an abrasive rotary tool using a molded elastic layer. A mold includes a cavity with a peripheral surface. An abrasive sheet is positioned so that a working surface of the abrasive sheet is positioned along at least a portion of the peripheral surface. A spindle is positioned within the mold to create a region between the spindle and the abrasive sheet. An elastomeric precursor material is injected into the region and solidified to form an elastic layer. As a result, the elastic layer is in direct contact with at least a portion of the opposed surface of the abrasive sheet and at least a portion of the exterior surface of the spindle. In this way, an abrasive rotary tool may be manufactured without using adhesive layers and/or fastening means.

The disclosure is generally directed to a method of manufacturing an abrasive rotary tool using a molded elastic layer. A mold includes a cavity with a peripheral surface. An abrasive sheet is positioned so that a working surface of the abrasive sheet is positioned along at least a portion of the peripheral surface. A spindle is positioned within the mold to create a region between the spindle and the abrasive sheet. An elastomeric precursor material is injected into the region and solidified to form an elastic layer. As a result, the elastic layer is in direct contact with at least a portion of the opposed surface of the abrasive sheet and at least a portion of the exterior surface of the spindle. In this way, an abrasive rotary tool may be manufactured without using adhesive layers and/or fastening means.

An abrasive article can include a body including a plurality of portions including a first abrasive portion and a second abrasive portion. The first abrasive portion can include a vitreous bond material and abrasive particles contained within the bond material. The second abrasive particles can include an organic bond material and abrasive particles contained within the bond material. The body can have a burst speed of at least 65 m/s. In an embodiment, the abrasive article can include an interior portion coupled to the first and second abrasive portions. In another embodiment, the interior portion can optionally include abrasive particles or a filler material.

An abrasive article can include a body including a plurality of portions including a first abrasive portion and a second abrasive portion. The first abrasive portion can include a vitreous bond material and abrasive particles contained within the bond material. The second abrasive particles can include an organic bond material and abrasive particles contained within the bond material. The body can have a burst speed of at least 65 m/s. In an embodiment, the abrasive article can include an interior portion coupled to the first and second abrasive portions. In another embodiment, the interior portion can optionally include abrasive particles or a filler material.