According to one embodiment of the present disclosure, there is provided a transfer apparatus comprising at least one arm configured to support a substrate; at least one gear disposed at a joint that rotatably supports the at least one arm, the at least one gear rotating the at least one arm; and a detector disposed to face the at least one gear and configured to detect a temperature of the at least one gear without contacting the at least one gear.

A wafer jig according to an embodiment may be used for a robot having a hand including a light emitting part and a light receiving part. The light receiving part detects detection light emitted from the light emitting part. The wafer jig includes a light source for emitting the notification light toward the light receiving part. The wafer jig outputs information to a hand side by emitting the notification light from the light source to the light receiving part.

Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

A coating system includes coating robots configured to coat a vehicle, and an operation robot. The operation robot includes a first arm configured to turn around a first axis; a second arm configured to turn around a second axis parallel to the first axis; a third arm configured to turn around a third axis parallel to the first axis; a fourth arm configured to turn around a fourth axis perpendicular to the first axis; a fifth arm configured to turn around a fifth axis parallel to the fourth axis; and a tip jig is supported at the fifth arm and is configured to turn around a sixth axis. The sixth axis is selectively parallel to the fifth axis or perpendicular to a plane which includes the fourth axis and the fifth axis.

A system for lifting a deformable object includes a support structure, two pairs of opposing arms coupled to the support structure, and a fluid power driver operatively coupled in parallel to the pairs of opposing arms via a fluid power system. Each of the arms includes inclined surfaces configured to contact the deformable object. When the support structure is positioned above the deformable object on the surface, the fluid power driver is configured to increase pressure in the fluid power system until the pressure in the fluid power system reaches a predetermined level such that (i) each of the pairs of opposing arms independently closes a distance until the inclined surfaces are in contact with sides of the deformable object, and (ii) the pairs of opposing arms exert a compressive force on the deformable object that causes the deformable object to slide up one or more of the inclined surfaces.

A compound fork device includes a first prong and a second prong spaced apart from the first prong. Each of the first and second prongs has an upper surface and a lower surface which is depressed relative to the upper surface. The upper surfaces of the first and second prongs are configured to cooperatively retain a first type container. The lower surfaces of the first and second prongs are configured to cooperatively retain a second type container having a configuration different from that of the first type container. A method and a system using the compound fork device are also disclosed.

A wafer magazine is disposed on a load port of an oven chamber. The wafer magazine contains one or more wafer boats with semiconductor wafers. The wafer boats are supported in the wafer magazine by wall slots of the wafer magazine. Using a push bar, the wafer boats are transferred out of the wafer magazine and into a wafer magazine jig also disposed on the load port. The transferred one or more wafer boats are supported in the wafer magazine jig by wall slots of the wafer magazine jig. During transfer, the wafer boats are supported across a gap between the wafer magazine and the wafer magazine jig by wall slots of a boat bridge interposed between the wafer magazine and the wafer magazine jig. After the transfer and using a robot, the wafer boats in the wafer magazine jig are moved into the oven chamber.

Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.

A substrate processing apparatus is disclosed. An exemplary substrate processing apparatus includes a reaction chamber; a susceptor plate positioned within the reaction chamber, constructed and arranged to support a substrate, and provided with one or more holes; a substrate lift mechanism comprising: a plurality of lift pins to support the substrate; and a lift pin support member to move the lift pins; in a vertical direction through the one or more holes; a substrate transfer robot provided with one or more robotic arms to transfer the substrate to a position above the lift pins; and a gas supply unit constructed and arranged to face the susceptor plate; wherein the gas supply unit is constructed and arranged to move in the vertical direction thereby positioning the gas supply unit in a processing position in the reaction chamber.

A substrate treating apparatus is provided. The substrate treating apparatus includes an atmospheric pressure transfer module provided with a first transfer robot having a first hand with a substrate placed thereon; a vacuum transfer module provided with a second transfer robot having a second hand with a substrate placed thereon; a load-lock chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an inner space convertible between an atmospheric pressure and a vacuum atmosphere; a process chamber coupled to the vacuum transfer module and treating the substrate; and a ring carrier supported by the first transfer robot or the second transfer robot for a transfer of a ring member. The ring carrier comprises a plate having the ring member placed thereon and at least one leg protruding from a bottom surface of the plate and placed at the first hand or the second hand.