Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

A magnetic sensing approach for determining a positioning characteristic of a soft robotic actuator. A magnetic field or a change in magnetic field of a magnetic member may be measured as it undergoes concurrent displacement with a soft actuator. Additionally, an example rolling robotic wheel is illustrated. The robotic wheel may utilize magnetic sensing as described herein.

A vertical surface cleaning device comprising a main body, a cleaning arm, a cleaning head, and leg mechanisms with grippers. The cleaning head applies a cleaning fluid on a surface to carry out a cleaning operation. A waste collector is provided to collect a waste material arising from the cleaning operation. The grippers may remain in a grip or in a release state. The segments of the leg mechanisms are articulatable to configure a first group of the leg mechanisms to stably hold the main body at a first place with the grippers remaining in the grip state. A second group of the leg mechanisms move in a desired direction with their grippers in release state while the first group stably holds the main body. The first group of the leg mechanisms then moves in the same direction while the second group holds the main body at a second place.

A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer.

A vertical surface cleaning device comprising a main body, a cleaning arm, a cleaning head, and leg mechanisms with grippers. The cleaning head applies a cleaning fluid on a surface to carry out a cleaning operation. A waste collector is provided to collect a waste material arising from the cleaning operation. The grippers may remain in a grip or in a release state. The segments of the leg mechanisms are articulatable to configure a first group of the leg mechanisms to stably hold the main body at a first place with the grippers remaining in the grip state. A second group of the leg mechanisms move in a desired direction with their grippers in release state while the first group stably holds the main body. The first group of the leg mechanisms then moves in the same direction while the second group holds the main body at a second place.

A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer.

Control for pixelated electrostatic adhesion can be provided by a voltage converter configured to increase an input voltage to an output voltage; a first gripping circuit, configured to selectively provide the output voltage at a first polarity to a first subset of electrodes of a plurality of electrodes; a second gripping circuit, configured to selectively provide the output voltage at a second polarity opposite to the first polarity to a second subset of electrodes of a plurality of electrodes that are associated with and different from the first subset of electrodes; a first release circuit, configured to selectively reverse the output voltage provided to the first subset of electrodes to the second polarity; and a second release circuit, configured to selectively reverse the output voltage provided to the second subset of electrodes to the first polarity.

Certain aspects of the present disclosure provide an apparatus for grasping an object. The apparatus includes a substrate comprising a plurality of electrode pixels; and a controller configured to energize each electrode pixel of the plurality of electrode pixels individually, wherein the apparatus is configured to grasp an object electrostatically using the substrate.

A method and system for piece-picking or piece put-away within a logistics facility. The system includes a central server and at least one mobile manipulation robot. The central server is configured to communicate with the robots to send and receive piece-picking data which includes a unique identification for each piece to be picked, a location within the logistics facility of the pieces to be picked, and a route for the robot to take within the logistics facility. The robots can then autonomously navigate and position themselves within the logistics facility by recognition of landmarks by at least one of a plurality of sensors. The sensors also provide signals related to detection, identification, and location of a piece to be picked or put-away, and processors on the robots analyze the sensor information to generate movements of a unique articulated arm and end effector on the robot to pick or put-away the piece.