A dust collection system for a circular saw may include an attachment. A fixed blade guard may define an exhaust port for removing debris drawn into the fixed blade guard. An attachment may be positioned adjacent to a fixed blade guard in fluid communication with an interior of the fixed blade guard through an aperture, where the attachment defines an exhaust port. An exhaust port can extend into fluid communication with a cavity formed by a protrusion, where the cavity has an expanded interior volume extending from and adjacent to the exhaust port. A channel defined by a connection configured for connecting to a vacuum source is in fluid communication with the expanded interior volume of the cavity through the exhaust port for pulling debris from within the fixed blade guard into the cavity and through the exhaust port and the channel toward the vacuum source.

A sheet perforating apparatus includes a punch unit configured to punch holes in a sheet from an image processing apparatus. A dust box is below the punch unit and detachably attached to a case. A lid member is attached to the dust box and is displaceable between a closed state, in which the lid member closes an opening of the dust box, and an open state, in which the lid member does not close the opening of the dust box. When in the open state, the lid member is electrically grounded to weaken static electricity of punch chips dropped from the punch unit to the lid member and directs the punch chips towards the opening.

A cutting unit of a cutting apparatus includes a fixed flange that is disposed at an end portion of a spindle to support a cutting blade and has a plurality of first gas jetting passages on a periphery thereof for jetting gas radially along a cutting edge of the cutting blade, a detachable flange that sandwiches the cutting blade in cooperation with the fixed flange and has a plurality of second gas jetting passages on a periphery thereof for jetting gas radially along the cutting edge of the cutting blade, a cover covering the cutting blade, the fixed flange, and the detachable flange, and a vacuum unit provided to the cover and configured to suck dust scattered inside the cover.

A head of a cutting device includes a base configured to be fixed to a machine tool, a cylindrical suction nozzle integral with the base, a connector integral with the base and configured to receive a suction pipe. The suction nozzle is perforated by at least one oblong hole, for example parallel to an axis of the suction nozzle.

A post-processing apparatus includes a side edge part removing portion that removes a side edge part from a sheet; a side edge part housing portion that houses the removed side edge part and is able to be pulled out from an apparatus body; a guide plate that is inclined in a direction intersecting with a moving direction of the side edge part and guides the removed side edge part along the moving direction to the housing portion; and a second guide plate that is arranged between the housing portion and the guide plate, and is transformable into a first form having substantially mountain-shaped inclined surfaces in which both end portions of the second guide plate along the moving direction are lower than a center portion thereof, and a second form having substantially valley-shaped inclined surfaces in which both the end portions are higher than the center portion.

A processing apparatus includes a holding table including a holding surface that holds a back surface side of a substrate and a processing unit that processes the substrate held on the holding surface. The holding surface includes a holding section that holds a central region of the substrate, a discharge groove that surrounds the holding section, and an outer circumferential groove that surrounds the discharge groove and communicates with a suction source to hold under suction the substrate. The processing apparatus uses the discharge groove to collect processing swarf produced by the processing unit.

The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.

The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.

A high-speed cutting device includes a mounting frame, a feeding mechanism, a linear chasing-cutting mechanism, an electrode guide plate, and an acceleration driving mechanism, the acceleration driving mechanism is provided on the discharging side of the electrode guide plate, and configured to perform acceleration driving on a material tape. The acceleration driving mechanism is provided behind the linear chasing-cutting mechanism to realize the acceleration driving of the material tape.

An apparatus includes channel assemblies in a rotatable section, a cutting assembly, a discharge assembly, and a cleanout assembly. The channel assembly holds a bulk instance of compressible material extending through upper and lower channels of a continuous channel. The cutting assembly moves in relation to the channel assembly to isolate the upper and lower channels, severing upper and lower material portions of the bulk instance. The discharge assembly directs gas into the lower channel of a channel assembly to discharge the lower material portion from the lower channel, based on radial alignment of a conduit assembly of the channel assembly with a conduit assembly of the discharge assembly. The cleanout assembly supplies a fluid through the conduit assembly of the channel assembly, based on radially alignment of the conduit assembly of the channel assembly with a conduit assembly of the cleanout assembly.