Portioning system 10 includes a scanner 200 for scanning work products 13 being carried on the conveyor 12. A cutter system 17 includes an array or manifold cutter 18 and single cutter 19 for cutting the work products into desired sized end pieces. The cutter assemblies 18 and 19 are carried on respective carriages 16 and 26 to move the cutters as required along predetermined cutting paths as controlled by control system 220.

The invention concerns a process for treating a workpiece, preferably for shaping a workpiece by ablating material, by a liquid jet guided laser beam. The process comprises the following steps: Production of a liquid jet by a nozzle; impinging the liquid jet on a reference surface allocated to the workpiece, whereby an intersection of the liquid jet with the reference surface defines a liquid jet-footprint; effecting a displacement between the liquid jet and the reference surface, whereby the liquid jet-footprint evolves to a trace along a trajectory associated with the trace during the time frame, wherein the trace covers a trace-area; irradiating the workpiece at least during part of the time frame with a laser beam coupled into the liquid jet, preferably for ablating material such that the trace has at least one overlap-area, wherein each of the at least one overlap-areas is defined by an associated common area of an associated second length-section of the trace and an associated first length-section of the trace and wherein the workpiece is irradiated by the laser beam along at least one of the length-sections. It concerns further a computerized numerical control (CNC) program for controlling a liquid jet guided laser machining device and a computer readable medium containing such a CNC program. Further, it contains a computer program for generating the above mentioned CNC program. Finally the invention concerns a liquid jet guided laser machining device to perform the above mentioned process.

The invention concerns a process for treating a workpiece, preferably for shaping a workpiece by ablating material, by a liquid jet guided laser beam. The process comprises the following steps: Production of a liquid jet by a nozzle; impinging the liquid jet on a reference surface allocated to the workpiece, whereby an intersection of the liquid jet with the reference surface defines a liquid jet-footprint; effecting a displacement between the liquid jet and the reference surface, whereby the liquid jet-footprint evolves to a trace along a trajectory associated with the trace during the time frame, wherein the trace covers a trace-area; irradiating the workpiece at least during part of the time frame with a laser beam coupled into the liquid jet, preferably for ablating material such that the trace has at least one overlap-area, wherein each of the at least one overlap-areas is defined by an associated common area of an associated second length-section of the trace and an associated first length-section of the trace and wherein the workpiece is irradiated by the laser beam along at least one of the length-sections. It concerns further a computerized numerical control (CNC) program for controlling a liquid jet guided laser machining device and a computer readable medium containing such a CNC program. Further, it contains a computer program for generating the above mentioned CNC program. Finally the invention concerns a liquid jet guided laser machining device to perform the above mentioned process.

According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

Portioning system 10 includes a scanner 200 for scanning work products 13 being carried on the conveyor 12. A cutter system 17 includes an array or manifold cutter 18 and single cutter 19 for cutting the work products into desired sized end pieces. The cutter assemblies 18 and 19 are carried on respective carriages 16 and 26 to move the cutters as required along predetermined cutting paths as controlled by control system 220.

Portioning system 10 includes a scanner 200 for scanning work products 13 being carried on the conveyor 12. A cutter system 17 includes an array or manifold cutter 18 and single cutter 19 for cutting the work products into desired sized end pieces. The cutter assemblies 18 and 19 are carried on respective carriages 16 and 26 to move the cutters as required along predetermined cutting paths as controlled by control system 220.

According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

An apparatus for cutting a multilayer material includes a splitter module and a uniaxial crystal element. The splitter module, located in a transmission path of an incident light beam, is used for splitting the incident light beam into a first polarized light beam and a second polarized light beam. The uniaxial crystal element is disposed adjacent to the splitter module and on a transmission path of the first polarized light beam and the second polarized light beam. The first polarized light beam and the second polarized light beam pass through the uniaxial crystal element individually by having the first polarized light beam and the second polarized light in correspondence to different index of refractions, so that two focuses with different focal lengths can be obtained. In addition, a method for cutting a multilayer material method is also provided.