B27N3/002

COMPOSITE PRODUCTS
20230044468 · 2023-02-09 ·

A sugar-based binder composition for manufacturing a composite product, notably a wood board, comprises at least one further particulate additive selected from the group consisting of:—particulate additive(s) having a BET specific surface area which is ≥50 m.sup.2/g;—amorphous silica particles;—fumed silica particles; and—untreated fumed silica particles.

Methods and compositions for preparing particle boards

An amorphous polylactic acid polymer having a weight average molecular weight in the range of about 35,000 to 180,000 is described. The polylactic acid polymer composition can be hammer milled without cryogenics result in the form of particles wherein 90% of the particles have particle size of about 250 μm or less and the material has a glass transition temperature of between about 55° C. to about 58° C. and a relative viscosity of about 1.45 to about 1.95 centipoise. The polymer composition can be used to form an aqueous suspension. The material is ideally suited for use in preparing particleboard. A method is disclosed for preparing such polylactic acid polymers. The method involves obtaining an amorphous polylactic acid polymer having a weight average molecular weight of between about 115,000 to about 180,000. Treating the polylactic acid polymer to reduce the molecular weight to between about 35,000 to 45,000 such that it has a glass transition temperature of between about 55° C. and 58° C. and a relative viscosity of about 1.45 to about 1.95. Material can be formed into particles in a commercial hammer mill with bypass such that 90% of the initial mass results in the particles which can pass thru a sieve having a pore size of about 250 μm. During particle board formation the temperature of around 140-140 C being reached to optimally activate the adhesive; Bond strengths and throughput rates of resulting particle boards can be controlled thereafter, with variable combination of particle sizes, adhesive loading and initial moisture content.

BINDERS AND ASSOCIATED PRODUCTS
20180002577 · 2018-01-04 ·

The present invention relates to a water-soluble pre-reacted binder composition, a method of its manufacture, a use of said pre-reacted binder composition, a method of manufacturing a collection of matter bound by a polymeric binder, a binder solution or dispersion comprising said pre-reacted binder composition, as well as products comprising the pre-reacted binder composition in a cured state.

REEL MADE OF MOLDED COMPONENTS
20180009628 · 2018-01-11 · ·

A composition for making a molded article such as a reel flange, and a method making the same, are provided. The composition may consist essentially of about 75-95 wt % dry waste wood and about 10-25 wt % binder such as melamine-urea-formaldehyde (MUF) or PMUF resin. The waste wood may be recycled wood fiber from pine or other hardwoods, sawdust and wood chips. The method comprises mixing dry waste wood with MUF or PMUF resin binder to make a wood/resin mixture, and compressing the wood/resin mixture in a mold cavity at a pressure and temperature.

Binder Compositions and Uses Thereof
20230002648 · 2023-01-05 ·

The present disclosure provides for aqueous, curable binder compositions, as well as articles and products comprising assemblies of matter comprising mineral fibers, synthetic fibers, natural fibers, cellulosic particles and sheet materials comprising the binder compositions disclosed herein.

PROCESS FOR THE PREPARATION OF A BONDING RESIN

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

NOVEL PROCESS FOR PREPARING A BONDING RESIN
20230026752 · 2023-01-26 · ·

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of a crosslinker and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

Process for Manufacturing Components from Reclaimed Textile Fabric Products
20230227655 · 2023-07-20 ·

The invention relates to a process for producing particle/polymer composites using a substrate S comprising shredded textile fabric products and a polymeric binder P, therewith providing a new method of recycling/upcycling textile waste. Furthermore, a process for the manufacturing of a molded article obtained from the textile-based particle/polymer composite and the use thereof are disclosed.

METHOD OF MANUFACTURING A STIFF ENGINEERED COMPOSITE

The method of making a compressed biocomposite body includes compressing a mass of biocomposite material comprised of discrete particles and a network of interconnected glucan-containing mycelia cells in the presence of heat and moisture into a compressed body having a density in excess of 18 pcf. Compression may take place batch wise in a press or continuously in a path of narrowing cross-section defined by a series of heated rollers.

Stable Lignin-Phenol Blend for Use in Lignin Modified Phenol-Formaldehyde Resins

Provided is a stable lignin-phenol blend for use in lignin modified phenol-formaldehyde resins comprising lignin in an amount between 10-80 wt %, phenol in an amount between 15-90 wt %, and a solubilizer in an amount between 0%-25 wt %.