A honeycomb body having a cutout, an assembly including the honeycomb body, and a method of manufacturing. The method includes forming the honeycomb body having a matrix of intersecting walls that define a plurality of cells and channels extending longitudinally through the honeycomb body. A subset of the channels are plugged to create a plurality of plugged cells in a reinforcement region of the honeycomb body. Material is removed from the honeycomb body within the reinforcement region in accordance with a peripheral shape that passes through the plugged cells to form a cutout that extends an axial depth into the honeycomb body.

A punch assembly for creating clean holes in a wallboard sheet having at least one surface with a face paper layer. The punch assembly includes a frame having a lower assembly configured to support the wallboard sheet, a plate on an upper frame assembly being reciprocable relative to the at least one surface of the wallboard sheet, at least one stripper bushing connected to the plate, where the at least one stripper bushing including a hole and a piercing edge, and at least one punch configured to move through the hole in the at least one stripper bushing. In operation, the plate is moved against the at least one surface of the wallboard sheet so that the piercing edge of the at least one stripper bushing contacts the face paper layer and at least partially cuts the face paper layer prior to the at least one punch moving through the wallboard sheet to form at least one clean hole in the wallboard sheet.

A punch assembly for creating clean holes in a wallboard sheet having at least one surface with a face paper layer. The punch assembly includes a frame having a lower assembly configured to support the wallboard sheet, a plate on an upper frame assembly being reciprocable relative to the at least one surface of the wallboard sheet, at least one stripper bushing connected to the plate, where the at least one stripper bushing including a hole and a piercing edge, and at least one punch configured to move through the hole in the at least one stripper bushing. In operation, the plate is moved against the at least one surface of the wallboard sheet so that the piercing edge of the at least one stripper bushing contacts the face paper layer and at least partially cuts the face paper layer prior to the at least one punch moving through the wallboard sheet to form at least one clean hole in the wallboard sheet.

“Green”, ceramic tapes intended as building blocks for making complex, fully ceramic components and devices for electronic-, lab-on-chip-, and sensing applications, the manufacture of which comprises in sequence: I. mixing of a ceramic “green” paste, II. homogenisation of a ceramic “green” paste, III. dimensioning and optionally structuring the ceramic “green” paste, IV. drying of the dimensioned and structured ceramic paste, in which: step iii) is performed in a combination of an extruder and a calender, the extruder being provided with a circular extrusion die, splitting and unfolding the extruded tube to a flat, continuous tape strip, using methylcellulose or derivatives thereof as binder, and, an additional step chosen among cutting and punching the thus dimensioned and optionally structured “green” paste, thereby making thick, “green” tapes. A method for its manufacture is also contemplated.

“Green”, ceramic tapes intended as building blocks for making complex, fully ceramic components and devices for electronic-, lab-on-chip-, and sensing applications, the manufacture of which comprises in sequence: I. mixing of a ceramic “green” paste, II. homogenisation of a ceramic “green” paste, III. dimensioning and optionally structuring the ceramic “green” paste, IV. drying of the dimensioned and structured ceramic paste, in which: step iii) is performed in a combination of an extruder and a calender, the extruder being provided with a circular extrusion die, splitting and unfolding the extruded tube to a flat, continuous tape strip, using methylcellulose or derivatives thereof as binder, and, an additional step chosen among cutting and punching the thus dimensioned and optionally structured “green” paste, thereby making thick, “green” tapes. A method for its manufacture is also contemplated.

A sensor element (12) has a cross-sectional area that continuously only increases from a positive (+) electrode side toward a negative (−) electrode side, thereby leading a hot spot, which attempts to move to the negative electrode side, to a lower resistance side. A position that is at nearly equal distances from paired electrodes (13 and 15) formed on either end of the sensor element (12) is set as a hot spot generating position, so as to avoid damage to the electrodes due to heat emitted by the hot spot.

A sensor element (12) has a cross-sectional area that continuously only increases from a positive (+) electrode side toward a negative (−) electrode side, thereby leading a hot spot, which attempts to move to the negative electrode side, to a lower resistance side. A position that is at nearly equal distances from paired electrodes (13 and 15) formed on either end of the sensor element (12) is set as a hot spot generating position, so as to avoid damage to the electrodes due to heat emitted by the hot spot.

A sensor element has a cross-sectional area that increases either uniformly or gradually from a positive (+) electrode side toward a negative () electrode side, thereby leading a hot spot, which attempts to move to the negative electrode side, to a lower resistance side. A position that is at nearly equal distances from paired electrodes formed on either end of the sensor element is set as a hot spot generating position, so as to avoid damage to the electrodes due to heat emitted by the hot spot.

A sensor element has a cross-sectional area that increases either uniformly or gradually from a positive (+) electrode side toward a negative () electrode side, thereby leading a hot spot, which attempts to move to the negative electrode side, to a lower resistance side. A position that is at nearly equal distances from paired electrodes formed on either end of the sensor element is set as a hot spot generating position, so as to avoid damage to the electrodes due to heat emitted by the hot spot.

Method for producing ceramic components, more particularly ceramic components having recesses and/or hollow spaces, there being at least one sintered ceramic part present. In order to improve the handling qualities of ceramic components, the sintered ceramic part can include a carrier or carrying section which is removed in the further processing from at least one ceramic component.