Patent classifications
B
B28
B28B
11/00
B28B11/14
B28B11/16
B28B11/163
B28B11/165
B28B11/165
CUTTING METHOD OF A LAYER OF CERAMIC POWDER MATERIAL, MANUFACTURING PROCESS AND MANUFACTURING PLANT OF CERAMIC ARTICLES
Cutting method of a layer(S) of ceramic powder material having a modulus of rupture that is smaller than about 10 N/mm.sup.2, comprising: a step of moving the layer(S) of ceramic powder material along a given path (P) in a moving direction (A) through a cutting station; and a cutting step, during which at least a first water-jet cutting device cuts said layer(S) of ceramic powder material along a first direction (D1) that is transverse to the moving direction (A), so as to cut said layer(S) of ceramic powder material and obtain a plurality of articles of ceramic powder material (MCP).