Provided are a method of full body cutting a brittle material without via the bend-breaking step, an apparatus of cutting a brittle material, a method of manufacturing a brittle material, and a cut brittle material. A method of cutting a brittle material, the method comprising: a conveyance cutting step of converging and irradiating an infrared ray to the brittle material linearly along a line using an infrared line heater while moving the infrared line heater relative to the brittle material in a direction along the line, thereby cutting the brittle material along the line.

An automated glass scoring device and a pillar post are provided. The pillar post includes a body having a fluid inlet port, at least one internal passage, a fluid exit port, and a fluid flow metering element. At least a portion of the fluid flow metering element is disposed within the internal passage. The at least one internal passage provides a path for a fluid flow from the inlet port to the fluid exit port, and the fluid exit port is positioned such that the fluid flow exiting the fluid exit port exits in close proximity to the cutter wheel.

An adapter device for ceramic cutting machines (2) that includes an adapter plug (1) for the hole (8) of the tool holder (7) of a ceramic cutting machine (2. The plug (1) includes a hollow cylindrical shape with a stop (12) that performs an axial fixation in a direction of the plug (1) in the hole (8) of a tool holder (7) of the ceramic cutting machine (2); and a longitudinal slot (13) that leaves open the inner hollow space of the plug (1) along its entire length. The longitudinal slot (13) has a narrower segment in a part of the plug (1) that is nearest the end (21) having the stop (12), and a wider segment in the part of the plug (1) that is near the end (22) of the plug (1) opposite the stop (12).

A wafer manufacturing method includes a peeling start point forming step of applying, to an ingot, a laser beam of such a wavelength as to be transmitted through the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be manufactured, from an end face of the ingot, to form a peeling start point, and a peeling step of peeling off, from the peeling start point, the wafer to be manufactured from the ingot. In the peeling step, degassed water is supplied to the end face of the ingot to generate a degassed water layer, and an ultrasonic wave is applied to break the peeling start point.

A manufacturing method for a band-shaped glass film (GF) includes use of: a plurality of rollers (10) configured to change a direction of the falling band-shaped glass film (GF) to a horizontal direction; and a first horizontal-conveyance unit (4) configured to convey the band-shaped glass film (GF) in the horizontal direction after the changing of the direction of the band-shaped glass film (GF). After a lower end of the band-shaped glass film (GF) passes through a position between the plurality of rollers (10) being at a retreated position (P2) and the first horizontal-conveyance unit (4), the plurality of rollers (10) are moved from the retreated position (P2) to a regular position (P1) to apply a pressing force to the band-shaped glass film (GF), to thereby cut the band-shaped glass film (GF) along a width direction by bend-breaking.

An automated glass scoring device and a pillar post are provided. The pillar post includes a body having a fluid inlet port, at least one internal passage, a fluid exit port, and a fluid flow metering element. At least a portion of the fluid flow metering element is disposed within the internal passage. The at least one internal passage provides a path for a fluid flow from the inlet port to the fluid exit port, and the fluid exit port is positioned such that the fluid flow exiting the fluid exit port exits in close proximity to the cutter wheel.

A scribing apparatus includes a horizontal table on which a glass plate is placed and fixed under vacuum suction; a feed screw and a Y-axis control motor 6 for moving the table along a pair of guide rails under scribe numerical control; a guide rail device body installed above the table along an X-axis direction; a carriage mounted on the guide rail device body so as to move in the X-axis direction while being guided; a feed screw and an X-axis control motor for moving the carriage in the X-axis direction under numerical control; and a scribe head installed on the carriage.

Provided are a method of full body cutting a brittle material without via the bend-breaking step, an apparatus of cutting a brittle material, a method of manufacturing a brittle material, and a cut brittle material. A method of cutting a brittle material, the method comprising: a conveyance cutting step of converging and irradiating an infrared ray to the brittle material linearly along a line using an infrared line heater while moving the infrared line heater relative to the brittle material in a direction along the line, thereby cutting the brittle material along the line.

A cutter head includes: a support platform; a double curved surface member mounted on the support platform and having a first curved surface and a second curved surface; a cutter wheel support member and a roller wheel support member moveably mounted on the support platform, respectively; a cutter wheel and a roller wheel mounted on the cutter wheel support member and the roller wheel support member, respectively; a first transmission mechanism mounted on the support platform, configured to be mated with the first curved surface, and connected to the cutter wheel support member, so as to transmit a movement of the double curved surface member to the cutter wheel; and a second transmission mechanism mounted on the support platform, configured to be mated with the second curved surface, and connected to the roller wheel support member, so as to transmit a movement of the double curved surface member to the roller wheel. The cutter head has a compact structure, and it improves the levelness of the cutter wheel and the roller wheel, and increases the mechanical precision.

A manufacturing method for a band-shaped glass film (GF) includes use of: a plurality of rollers (10) configured to change a direction of the falling band-shaped glass film (GF) to a horizontal direction; and a first horizontal-conveyance unit (4) configured to convey the band-shaped glass film (GF) in the horizontal direction after the changing of the direction of the band-shaped glass film (GF). After a lower end of the band-shaped glass film (GF) passes through a position between the plurality of rollers (10) being at a retreated position (P2) and the first horizontal-conveyance unit (4), the plurality of rollers (10) are moved from the retreated position (P2) to a regular position (P1) to apply a pressing force to the band-shaped glass film (GF), to thereby cut the band-shaped glass film (GF) along a width direction by bend-breaking.