Patent classifications
B29B7/02
TAMPER RESISTANT DOSAGE FORMS
The present invention relates to pharmaceutical dosage forms, for example to a tamper resistant dosage form including an opioid analgesic, and processes of manufacture, uses, and methods of treatment thereof.
TAMPER RESISTANT DOSAGE FORMS
The present invention relates to pharmaceutical dosage forms, for example to a tamper resistant dosage form including an opioid analgesic, and processes of manufacture, uses, and methods of treatment thereof.
ELECTROSTATIC DISSIPATING MAT
An electrostatic mat, wherein the mat comprises at least one electrostatic layer, wherein the at least one layer comprises an elastomeric rubber, wherein the elastomeric rubber comprises 20-100 phr elastomeric polyether, wherein the elastomeric polyether comprises 10-75 wt % ethylene oxide, 20-70 wt % epihalohydrin, and 0-10% vinyloxirane. The mat prevents the generation of voltage when it is walked on and/or dissipates the charge that was generated.
ELECTROSTATIC DISSIPATING MAT
An electrostatic mat, wherein the mat comprises at least one electrostatic layer, wherein the at least one layer comprises an elastomeric rubber, wherein the elastomeric rubber comprises 20-100 phr elastomeric polyether, wherein the elastomeric polyether comprises 10-75 wt % ethylene oxide, 20-70 wt % epihalohydrin, and 0-10% vinyloxirane. The mat prevents the generation of voltage when it is walked on and/or dissipates the charge that was generated.
METHOD AND COMPOSITION INCLUDING THERMOPLASTIC PARTICLES AND HOLLOW MICROSPHERES AND ARTICLES MADE FROM THEM
A method of making a molded article. The method includes introducing into a mold a composition including thermoplastic particles with hollow microspheres attached to their outer surfaces, rotating the mold, and heating the mold at a temperature at which the thermoplastic particles melt. The hollow microspheres are included in the molded article. Molded articles are also disclosed. A powder composition that includes thermoplastic powder particles and hollow ceramic microspheres attached to outer surfaces of at least some of the thermoplastic powder particles is also disclosed. The hollow ceramic microspheres are either adhered to the outer surfaces of at least some of the thermoplastic powder particles with a liquid or embedded in the outer surfaces of at least some of the thermoplastic powder particles.
METHOD AND COMPOSITION INCLUDING THERMOPLASTIC PARTICLES AND HOLLOW MICROSPHERES AND ARTICLES MADE FROM THEM
A method of making a molded article. The method includes introducing into a mold a composition including thermoplastic particles with hollow microspheres attached to their outer surfaces, rotating the mold, and heating the mold at a temperature at which the thermoplastic particles melt. The hollow microspheres are included in the molded article. Molded articles are also disclosed. A powder composition that includes thermoplastic powder particles and hollow ceramic microspheres attached to outer surfaces of at least some of the thermoplastic powder particles is also disclosed. The hollow ceramic microspheres are either adhered to the outer surfaces of at least some of the thermoplastic powder particles with a liquid or embedded in the outer surfaces of at least some of the thermoplastic powder particles.
Preparation Method of Heat-Conducting Interface Material
The present application belongs to the field of heat conducting materials technology, and in particular, to a preparation method of a heat conducting interface material. The present application discloses a preparation method of a heat-conducting interface material, which comprises: S1, stirring and mixing; S2. orientation process: putting a mixed material obtained in the step S1 into a hydraulic injection extruder, spitting the material out through a needle nozzle and arranging the material neatly in a container in a strip shape, and after stacking the material to ½-¼ of a height of the container, vibrating the material in a vibrating compactor and repeatedly performing stacking 2-4 times; S3, vacuum compaction; S4. curing; S5. slicing.
Preparation Method of Heat-Conducting Interface Material
The present application belongs to the field of heat conducting materials technology, and in particular, to a preparation method of a heat conducting interface material. The present application discloses a preparation method of a heat-conducting interface material, which comprises: S1, stirring and mixing; S2. orientation process: putting a mixed material obtained in the step S1 into a hydraulic injection extruder, spitting the material out through a needle nozzle and arranging the material neatly in a container in a strip shape, and after stacking the material to ½-¼ of a height of the container, vibrating the material in a vibrating compactor and repeatedly performing stacking 2-4 times; S3, vacuum compaction; S4. curing; S5. slicing.
TAMPER RESISTANT DOSAGE FORMS
The present invention relates to pharmaceutical dosage forms, for example to a tamper resistant dosage form including an opioid analgesic, and processes of manufacture, uses, and methods of treatment thereof.
TAMPER RESISTANT DOSAGE FORMS
The present invention relates to pharmaceutical dosage forms, for example to a tamper resistant dosage form including an opioid analgesic, and processes of manufacture, uses, and methods of treatment thereof.