The present invention is directed to a process for the production of thermally stabilized agglomerated lignin, which avoids melting and/or significant foaming during subsequent thermal processing. The process comprises the steps of providing agglomerated lignin and heating the agglomerated lignin to obtain thermally stabilized agglomerated lignin. The thermally stabilized lignin can be further processed to a carbon enriched material.

The present invention is directed to a process for the production of thermally stabilized agglomerated lignin, which avoids melting and/or significant foaming during subsequent thermal processing. The process comprises the steps of providing agglomerated lignin and heating the agglomerated lignin to obtain thermally stabilized agglomerated lignin. The thermally stabilized lignin can be further processed to a carbon enriched material.

A continuous granulation system for obtaining conditioned granules is disclosed. The system comprises a processor configured to produce a continuous flow of granules at an outlet of the processor. The system also comprises a collection chamber positioned downstream from the processor and configured to collect the granules from the outlet. Further, the system comprises an air displacement device coupled to the collection chamber and configured to create a unidirectional flow of air at the outlet in a direction of the granules exiting the processor and away from the outlet. The unidirectional flow of air conditions the granules obtained in the collection chamber. A continuous granulation method and a continuous granule collection system for obtaining the conditioned granules is also disclosed.

A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, $\frac{\sigma D\times \sigma H}{\sigma D+\sigma H}\le 1.0,$
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

A method for the treatment of residual thermoplastic powder from an additive manufacturing process includes, in one step of the process, a powder that includes the residual powder is provided and compressed into granules as raw material for a primary shaping process. A pressing apparatus with two roller elements rotating in opposite directions and having lateral surfaces adjacent to one another in a pressing area is used to compress the powder into the granules. The lateral surfaces each having a plurality of molding elements assigned to one another in pairs such that the powder is compressed into granules in the pressing area. A cam mechanism positioned within one of the roller elements and configured to deflect the plurality of molding elements radially as a function of an angle of rotation of the roller element can be included.

A method for the treatment of residual thermoplastic powder from an additive manufacturing process includes, in one step of the process, a powder that includes the residual powder is provided and compressed into granules as raw material for a primary shaping process. A pressing apparatus with two roller elements rotating in opposite directions and having lateral surfaces adjacent to one another in a pressing area is used to compress the powder into the granules. The lateral surfaces each having a plurality of molding elements assigned to one another in pairs such that the powder is compressed into granules in the pressing area. A cam mechanism positioned within one of the roller elements and configured to deflect the plurality of molding elements radially as a function of an angle of rotation of the roller element can be included.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

The present invention relates to a process for producing a compacted material comprising the steps of providing a powder material and a polymer binder, simultaneously or subsequently feeding the powder material and the polymer binder into a high speed mixer unit, mixing the powder material and the polymer binder in the high speed mixer unit until formation of a compacted material, and reducing the temperature of the obtained compacted material below the melting point or glass transition temperature of the polymer binder.

Disclosed are a carbon nanomaterial pellet and a method for preparing same. More particularly, it relates to a carbon nanomaterial pellet having a specific size and a high apparent density prepared by a simple process using only a rotary tablet press without mixing a carbon nanomaterial powder with a solvent or an additive, which is capable of solving the powder dust problem occurring when preparing a polymer composite from a carbon nanomaterial in the form of powder, thus improving physical properties and remarkably reducing cost of packaging and transportation, and a method for preparing the carbon nanomaterial pellet from a carbon nanomaterial powder.