A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, $\frac{\sigma D\times \sigma H}{\sigma D+\sigma H}\le 1.0,$
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

A method for manufacturing an electrically conductive composite material includes obtaining a composite material which includes a thermoplastic matrix and short carbon fibers and is free of carbon nanotubes, preheating a furnace until a predetermined target temperature is reached, inserting the composite material into the preheated furnace once the target temperature has been reached, and heating the composite material in the furnace at the predetermined target temperature which is kept constant for a predetermined duration.

A method for manufacturing an electrically conductive composite material includes obtaining a composite material which includes a thermoplastic matrix and short carbon fibers and is free of carbon nanotubes, preheating a furnace until a predetermined target temperature is reached, inserting the composite material into the preheated furnace once the target temperature has been reached, and heating the composite material in the furnace at the predetermined target temperature which is kept constant for a predetermined duration.

A method for fabrication of a 3D printed part with high through-plane thermal conductivity is provided, where pure polymer particles and a carbon-based filler for heat conduction are subjected to milling and mixing in the mechanochemical reactor disclosed in Chinese patent ZL 95111258.9 under the controlled milling conditions including milling pan surface temperature, milling pan pressure, and number of milling cycles; then a resulting mixture is extruded to obtain 3D printing filaments; and finally, the 3D printing filaments are used to fabricate the 3D printed part with high through-plane thermal conductivity through fused deposition modeling (FDM) 3D printing. The fabrication method can realize the fabrication of a 3D printed part with high through-plane thermal conductivity through the FDM 3D printing technology, features simple process, continuous production, etc., and is suitable for the industrial production of thermally-conductive parts with complex structures.

A method for fabrication of a 3D printed part with high through-plane thermal conductivity is provided, where pure polymer particles and a carbon-based filler for heat conduction are subjected to milling and mixing in the mechanochemical reactor disclosed in Chinese patent ZL 95111258.9 under the controlled milling conditions including milling pan surface temperature, milling pan pressure, and number of milling cycles; then a resulting mixture is extruded to obtain 3D printing filaments; and finally, the 3D printing filaments are used to fabricate the 3D printed part with high through-plane thermal conductivity through fused deposition modeling (FDM) 3D printing. The fabrication method can realize the fabrication of a 3D printed part with high through-plane thermal conductivity through the FDM 3D printing technology, features simple process, continuous production, etc., and is suitable for the industrial production of thermally-conductive parts with complex structures.

Provided are a resin composition in which there is a particularly good achievement of low specific gravity, high rigidity, and a low coefficient of linear expansion, a resin composition in which low specific gravity, high rigidity, a low coefficient of thermal expansion, and low water absorbency are all achieved, are a resin composition which has low specific gravity and in which there is a good achievement of the contradictory properties of high toughness and low thermal expansion. Provided in an embodiment is a resin composition containing a first polymer forming a continuous phase, a second polymer forming a dispersed phase, and cellulose, wherein the first polymer is a polyamide and the second polymer is at least one polymer selected from the group consisting of crystalline resins having a melting point of at least 60° C. and non-crystalline resins having a glass transition temperature of at least 60° C.

A polyvinyl halide compound has thermal conductivity and includes polyvinyl halide resin, natural or synthetic graphite of flake or spheroid form, and at least 0.5 weight percent of epoxidized vegetable oil. Selection of types and amounts of graphite and epoxidized vegetable oil provide thermal conductivity while other desirable properties of the compound are suitably maintained. The compound can be used for making any end use article that needs flame retardance and good thermal management and is especially useful as a thermally conductive material to replace die cast or extruded aluminum heat sinks in industrial applications, such as LED lighting fixtures.

A resin composition containing a polyimide resin particle (A) and at least one selected from the group consisting of a thermoplastic resin (B) and a thermosetting resin (C), wherein the polyimide resin particle (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the polyimide resin particle (A) has a volume average particle size D50 of 5 to 200 μm.

(R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.)

##STR00001##

A fiber-reinforced resin molding material includes at least components (A) to (D), wherein the fiber-reinforced resin molding material has a weight loss on heating, when heated at 300° C. for 10 minutes either in a nitrogen atmosphere or in an air atmosphere, of 1.5% or less, and components (A) to (D) are:

(A) an amorphous thermoplastic resin: 100 parts by weight
(B) a reinforcement fiber: 4 to 60 parts by weight
(C) a phosphorus-based flame retardant: 20 to 60 parts by weight
(D) an antioxidant (D): 1.0% by weight or more.

A fiber-reinforced resin molding material includes at least components (A) to (D), wherein the fiber-reinforced resin molding material has a weight loss on heating, when heated at 300° C. for 10 minutes either in a nitrogen atmosphere or in an air atmosphere, of 1.5% or less, and components (A) to (D) are:

(A) an amorphous thermoplastic resin: 100 parts by weight
(B) a reinforcement fiber: 4 to 60 parts by weight
(C) a phosphorus-based flame retardant: 20 to 60 parts by weight
(D) an antioxidant (D): 1.0% by weight or more.