A method of forming a three-dimensional object, wherein said three-dimensional object is an insert for use between a helmet and a human body, is described. The method may use a polymerizable liquid, or resin, useful for the production by additive manufacturing of a three-dimensional object, comprising a mixture of (i) a light polymerizable liquid first component, and (ii) a second solidifiable component that is different from said first component.

A method of forming a three-dimensional object is carried out by: (a) providing a carrier and an optically transparent member having a build surface, the carrier and the build surface defining a build region therebetween; (b) filling the build region with a polymerizable liquid, the polymerizable liquid including a mixture of (i) a light polymerizable liquid first component, and (ii) a second solidifiable component that is different from the first component; (c) irradiating the build region with light through the optically transparent member to form a solid polymer scaffold from the first component and also advancing the carrier away from the build surface to form a three-dimensional intermediate having the same shape as, or a shape to be imparted to, the three-dimensional object, and containing the second solidifiable component carried in the scaffold in unsolidified and/or uncured form; and (d) concurrently with or subsequent to the irradiating step, solidifying and/or curing the second solidifiable component in the three-dimensional intermediate to form the three-dimensional object.

A molding die includes a first mold assembly, a second mold assembly, and a mold core. The first and second mold assemblies are adapted to be clamped together. The mold core defines a molding groove. The molding core is pressed between the first and second mold assemblies to form a molding cavity. The second mold assembly includes a light transmitting area corresponding to the molding cavity, so that the molding cavity will receive incident light through the light transmitting area. In the molding die, the first mold assembly, the second mold assembly, and the mold core cooperate to form the molding cavity, adhesive is injected into the molding cavity, and the molding cavity receives incident light through the light transmitting area, so that curing efficiency of the adhesive is improved, production efficiency is high, shape of molded adhesive is uniform, and product quality is improved.

An additive manufacturing apparatus includes a vat with multiple chambers and at least one of the chambers is a resin chamber configured to receive a radiant-energy-curable resin. A build surface is defined by the resin chamber within the vat, wherein at least a portion of the build surface is transparent. The additive manufacturing apparatus includes a stage that is positioned facing the vat and the build surface and the stage is configured to hold a stacked arrangement of one or more cured layers of the radiant-energy-curable resin.

A method of forming a three-dimensional object includes providing a carrier and an optically transparent member having a build surface. The carrier and the build surface define a build region therebetween. The method further includes filling said build region with a polymerizable liquid; continuously or intermittently irradiating said build region with light through said optically transparent member to form a solid polymer from said polymerizable liquid; applying a reduced pressure and/or polymer inhibitor-enriched gas to the polymerizable liquid through the optically transparent member to thereby reduce a gas content of the polymerizable liquid; and continuously or intermittently advancing (e.g., sequentially or concurrently with said irradiating step) said carrier away from said build surface to form said three-dimensional object from said solid polymer.

A three-dimensional printing system for solidifying a photocurable resin in a layer-by-layer manner at a build plane includes a scan module, a transparent plate, a sensor, and a controller. The scan module is configured to scan the light beam along two axes to address the build plane. The transparent plate is positioned in the optical path between the scan module and the build plane. The transparent plate has at least one reflective feature in the optical path. The sensor is mounted above the glass plate and is positioned to receive light reflected from the reflective feature. The controller is configured to operate the scan module to scan the light beam across the build plane, receive a signal from the sensor when the light beam impinges upon the reflective feature, and analyze the signal to verify a proper alignment of the light beam to the build plane.

Described herein are three-dimensional (3D) printer systems and methods, which may provide for “continuous pull” 3D printing. An illustrative 3D printer includes: a resin container, a base plate, a light source arranged below the resin container and operable to cure resin in the resin container; and a control system operable to: (a) receive model data specifying a 3D structure; (b) determine 2D images corresponding to layers of the 3D object; and (c) generate control signals to operate the light source and the base plate to sequentially form the layers of the 3D object onto the base plate, wherein the base plate moves a formed portion of the 3D object upward after formation of each layer, and wherein at least a surface of a formed portion of the 3D object remains in contact with the resin in the resin container throughout the formation of the layers of the 3D object.

Molding optical components with fine (e.g., micron-scale) features from optical adhesive or polymer can be difficult because the optical components often stick to the mold. If the component sticks to the mold, then either the component or the mold may be damaged or destroyed as the component is removed from the mold. This damage can be reduced or avoided altogether by illuminating the interface between the component and the mold with ultraviolet (UV) light before releasing the component from the mold. The UV light reduces the adhesive forces that cause the component and the mold to stick together, making it easier to remove the component from mold without damaging either the mold or the component.

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquid contacting the build surface, (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, wherein the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface while concurrently filling the subsequent build region with polymerizable liquid as in step (b). Apparatus for carrying out the method is also described.

Provided is a silicone mold with which a curable composition containing an epoxy resin can be molded with good precision even if used repeatedly. The silicone mold according to an embodiment of the present invention is a silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold including a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C.