A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, $\frac{\sigma D\times \sigma H}{\sigma D+\sigma H}\le 1.0,$
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Disclosed is a materials handling system, a patterned product, and process of fabricating a patterned product, such as non-pvc thermoplastic, through-color, flooring product includes a narrow, long-grained, striated color pattern. The process includes mixing colored particles into a mixed composition, receiving the mixed composition between calendering rolls wherein a front calendering roll which is hotter than a back calendering roll, and forming a product with an elongated pattern. The materials handling system includes a mixing portion disposed to mix colored particles into a mixed composition. The system also include a processing portion disposed to receive the mixed composition, the processing portion having a front calendering roll which is hotter than a back calendering roll.

The present application belongs to the field of heat conducting materials technology, and in particular, to a preparation method of a heat conducting interface material. The present application discloses a preparation method of a heat-conducting interface material, which comprises: S1, stirring and mixing; S2. orientation process: putting a mixed material obtained in the step S1 into a hydraulic injection extruder, spitting the material out through a needle nozzle and arranging the material neatly in a container in a strip shape, and after stacking the material to ½-¼ of a height of the container, vibrating the material in a vibrating compactor and repeatedly performing stacking 2-4 times; S3, vacuum compaction; S4. curing; S5. slicing.

Multiple processes for preparing porous articles are described. The porous articles can be in a wide array of shapes and configurations. The methods include providing a soluble material in particulate form and forming a packed region from the material. The methods also include contacting a flowable polymeric material with the packed region such that the polymeric material is disposed in voids in the packed region. The polymeric material is then at least partially solidified. The soluble material is then removed such as by solvent washing to thereby produce desired porous articles. Also described are systems for performing the various processes.

Multiple processes for preparing porous articles are described. The porous articles can be in a wide array of shapes and configurations. The methods include providing a soluble material in particulate form and forming a packed region from the material. The methods also include contacting a flowable polymeric material with the packed region such that the polymeric material is disposed in voids in the packed region. Also described are systems for performing the various processes.

Multiple processes for preparing porous articles are described. The porous articles can be in a wide array of shapes and configurations. The methods include providing a soluble material in particulate form and forming a packed region from the material. The methods also include contacting a flowable polymeric material with the packed region such that the polymeric material is disposed in voids in the packed region. The polymeric material is then at least partially solidified. The soluble material is then removed such as by solvent washing to thereby produce desired porous articles. Also described are systems for performing the various processes.

A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1,

[00001]$\frac{.Math..Math.D.Math..Math.H}{.Math..Math.D+.Math..Math.H}1.0,$

where D is a standard deviation of tablet diameters and H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Multiple processes for preparing porous articles are described. The porous articles can be in a wide array of shapes and configurations. The methods include providing a soluble material in particulate form and forming a packed region from the material. The methods also include contacting a flowable polymeric material with the packed region such that the polymeric material is disposed in voids in the packed region. The polymeric material is then at least partially solidified. The soluble material is then removed such as by solvent washing to thereby produce desired porous articles. Also described are systems for performing the various processes.

A method for manufacturing three-dimensional products with at least one inclined product portion made of a fiber-containing material using at least one forming tool and a forming tool are described. Vibrations are introduced via a device and this results in an improved compression of fiber-containing material in the region of inclined portions.

A method and production line are provided for producing sheet products by thermopressing raw materials from thermoplastic plastics and may be used for manufacturing substantially flat products. The method includes thermopressing the raw materials from thermoplastic plastics under pressure to produce in at least one press, and subsequent cooling under pressure of a semi-finished sheet product in at least one other press. A mold with detachable parts may be used, starting from dosing and feeding the raw materials to thermopressing and cooling, and ending with removing a finished sheet product. A production line for producing the sheet products by thermopressing the raw materials from thermoplastic plastics is also provided.