A method for conveying a concave object having a lateral wall away from a mould comprises the steps of: providing a removing element, movable along a path, and a guiding element; extracting the object from the mould and releasing the object onto a supporting surface in a position interposed between the removing element and the guiding element, while the removing element is at a distance from the object; displacing the removing element towards the object, so that the removing element makes contact with the lateral wall; moving the removing element along a portion of the path, to convey the object towards a delivery position.

A compression molding system includes a first extruder to output melted plastic, and a second extruder downstream from the first extruder to mix the melted plastic with wood chips to output a composite material. A transfer valve alternately directs the composite material between inner block molds and outer block molds. Each inner block mold has an inner block press associated therewith to press the composite material into a desired shape of an inner block having an opening on one side. Each outer block mold has an outer block press associated therewith to press the composite material into a desired shape of an outer block having an opening on one side. A press assembly presses one of the inner blocks into the opening in one of the outer blocks to form a double wall block.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

A method for conveying a concave object having a lateral wall away from a mould comprises the steps of: providing a removing element, movable along a path, and a guiding element; extracting the object from the mould and releasing the object onto a supporting surface in a position interposed between the removing element and the guiding element, while the removing element is at a distance from the object; displacing the removing element towards the object, so that the removing element makes contact with the lateral wall; moving the removing element along a portion of the path, to convey the object towards a delivery position.

A die arrangement for pressing, sintering or stamping comprising: a die body with a cavity extending from an opening at a first end of said die body to an opening at a second end of said die body, and one or more moving parts arranged around the opening at said first end of said die body, wherein each moving part is displaceable between a first position and a second position. The die body may be configurable to receive a die plunger at said second end of said die body, said plunger being displaceable within the cavity. The die arrangement may further comprise an outer sleeve mounted on the die body, the outer sleeve being coaxial with the die body and having a first outer sleeve portion nearest to the first end of said die body, and one of: a second outer sleeve portion nearest to the second end of said die body; a second outer sleeve portion fixedly attached to the plunger base nearest to the second end of said die body; or, a second outer sleeve portion extending directly from the plunger base nearest to the second end of said die body, the second outer sleeve portion and the plunger base being a single unitary component.

A die arrangement for pressing, sintering or stamping comprising: a die body with a cavity extending from an opening at a first end of said die body to an opening at a second end of said die body, and one or more moving parts arranged around the opening at said first end of said die body, wherein each moving part is displaceable between a first position and a second position. The die body may be configurable to receive a die plunger at said second end of said die body, said plunger being displaceable within the cavity. The die arrangement may further comprise an outer sleeve mounted on the die body, the outer sleeve being coaxial with the die body and having a first outer sleeve portion nearest to the first end of said die body, and one of: a second outer sleeve portion nearest to the second end of said die body; a second outer sleeve portion fixedly attached to the plunger base nearest to the second end of said die body; or, a second outer sleeve portion extending directly from the plunger base nearest to the second end of said die body, the second outer sleeve portion and the plunger base being a single unitary component.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This off-device approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This off-device approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template May be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.