An apparatus according to the present exemplary embodiment is an apparatus that forms a composition on a substrate using a mold. The apparatus includes a gas supply unit that supplies gas to a periphery of a space sandwiched between the mold and the substrate, a deforming mechanism that deforms the mold, and a control unit that, in a state in which the gas supply unit increases a density of the gas in the periphery of the space sandwiched between the mold and the substrate, after the deforming mechanism deforms the mold in a concave shape with respect to the substrate and releases the mold from the deformation, brings the mold into contact with the composition on the substrate.

A thermally insulated VIP sandwich shipper for a temperature sensitive payload is provided. The shipper comprises an outer shell, an inner shell and vacuum insulated panels sandwiched therebetween. The outer shell and the inner shell may be unitary rigid structures made of an expanded foam material and comprising a bottom having a perimeter and sides extending from the bottom perimeter and terminating in a rim. The inner shell rim may be spaced from the outer shell rim to define a gap, the gap being sealed to create an enclosed space within which the vacuum insulated panels are located. Each vacuum insulated panel may be oriented substantially orthogonally to at least one adjacent vacuum insulated panel and have an edge that abuts the adjacent vacuum insulated panels.

An imprint apparatus cures an imprint material by irradiating the imprint material with light while the imprint material on a substrate is in contact with a pattern region of a mold. The imprint apparatus includes a first supply unit configured to supply a first gas to a gap between the substrate and the mold, the first gas accelerating filling of recessed portions of the pattern region with the imprint material, and a second supply unit configured to supply a second gas to the gap, the second gas inhibiting curing of the imprint material.

An apparatus may include a substrate holder configured to hold a substrate. The substrate holder may include a first chucking region having a first area and an adjacent region extending from the chucking region. The apparatus may also include a superstrate holder configured to hold a superstrate. The superstrate holder may include a second chucking region having a second area. The second area may be larger than the first area and the superstrate holder faces the substrate holder forming a first gap between the adjacent region surface and the superstrate and a second gap between the substrate and the superstrate. The apparatus may also include a gas supply system between the first gap and the second gap. The superstrate holder may alter a shape of the held superstrate to decrease the first gap and increase the second gap.

A method of and apparatus for sinter forging a precursor powder to form a film may reduce or eliminate the stress in the film and may facilitate processing of continuous length of films such as ceramic films for use in batteries. The precursor powder can be provided on a substrate and is simultaneously heated and pressed in a pressing direction parallel to a thickness of the film so as to sinter and densify the precursor powder to form the film in a sinter forging area. Notably, in a plane perpendicular to the pressing direction, there are no lateral constraints on the sinter forging area or the material received therein.

An imprint apparatus that forms a pattern on a substrate by using a mold, the apparatus comprises a supply unit configured to supply an imprint material to the substrate; a contact unit configured to contact the imprint material that has been supplied to the substrate with a mold; a substrate stage configured to move the substrate; a gas supply unit that is provided between the supply unit and the contact unit, and supply gas toward the substrate; and a flow volume adjustment unit configured to adjust a flow volume of the gas that is supplied from the gas supply unit, while the substrate stage moves the substrate from a supply position at which the imprint material is supplied by the supply unit to a contact position at which the imprint material is contacted with the mold by the contact unit.

An imprint apparatus that forms a pattern on a substrate by using a mold, the apparatus comprises a supply unit configured to supply an imprint material to the substrate; a contact unit configured to contact the imprint material that has been supplied to the substrate with a mold; a substrate stage configured to move the substrate; a gas supply unit that is provided between the supply unit and the contact unit, and supply gas toward the substrate; and a flow volume adjustment unit configured to adjust a flow volume of the gas that is supplied from the gas supply unit, while the substrate stage moves the substrate from a supply position at which the imprint material is supplied by the supply unit to a contact position at which the imprint material is contacted with the mold by the contact unit.

An imprint apparatus that forms a pattern on a substrate by using a mold, the apparatus comprises a supply unit configured to supply an imprint material to the substrate; a contact unit configured to contact the imprint material that has been supplied to the substrate with a mold; a substrate stage configured to move the substrate; a gas supply unit that is provided between the supply unit and the contact unit, and supply gas toward the substrate; and a flow volume adjustment unit configured to adjust a flow volume of the gas that is supplied from the gas supply unit, while the substrate stage moves the substrate from a supply position at which the imprint material is supplied by the supply unit to a contact position at which the imprint material is contacted with the mold by the contact unit.

The purpose of the invention is a device that compacts thin sheets of thermoplastic material in order to facilitate their subsequent recycling by means of a suction air current combined with another impulsion current by means of heated air. The device includes an axial fan (1), which is coupled in the lower part to an essentially prismatic structure (10), an inlet nozzle (2) placed in the lower part of the prismatic structure (10); a heated mould (3) housed in the intermediate part of the prismatic structure (10) as a continuation from the inlet nozzle (2), where the heated mould (3) is provided with a plurality of slots that allow the passing of the suction air current; a guiding conduit between the inlet nozzle (2) and the heated mould (3); and a slot (4) housed between the heated mould (3) and the fan (1).

An apparatus according to the present exemplary embodiment is an apparatus that forms a composition on a substrate using a mold. The apparatus includes a gas supply unit that supplies gas to a periphery of a space sandwiched between the mold and the substrate, a deforming mechanism that deforms the mold, and a control unit that, in a state in which the gas supply unit increases a density of the gas in the periphery of the space sandwiched between the mold and the substrate, after the deforming mechanism deforms the mold in a concave shape with respect to the substrate and releases the mold from the deformation, brings the mold into contact with the composition on the substrate.