A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.

The manufacturing method of a motor core includes attaching an ID code to a stack of blanked members in which a magnet insertion hole to fill with a resin material is formed, the ID code containing information in accordance with a type of the stack, reading the information from the ID code which is attached to the stack, and setting a mold condition based on the information read from the ID code. The mold condition includes at least one type of condition including: the resin material to be injected to the magnet insertion hole, an injection amount of the resin material, and a discharge position of the resin material. A mold device is controlled to inject the resin material to the magnet insertion hole in accordance with the mold condition.

A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.

Lead screw nuts having a body having a threaded opening having a thread region formed from a plurality of different materials having different properties, e.g., a thread region formed from a first material, such as a relatively low friction material, and a second material, such as a relatively high strength material (having thread portions formed from the first material and thread portions formed from the second material).

An example method for making a radio frequency identification (RFID) tag according to the present disclosure includes holding a transponder within a cavity of a mold using a fixture, closing the mold, injecting material into the mold cavity and around the transponder to form a part of the RFID tag, opening the mold, and ejecting the part from the mold.

Methods, devices, and systems are provided for the encapsulation of electronic devices. The encapsulation includes positioning an electronic device in a cavity of a mold, and screen or stencil printing an encapsulant, in a liquid form, around the flexible electronic device. The mold is of a sufficient thickness to allow the encapsulant to completely cover electronic components mounted on a first surface of the electronic device.

The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based electronic circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.

Provided are a device and method for molding an FPC and a plastic part, which belongs to the field of FPC processing technology. The method for molding an FPC and a plastic part includes preprocessing a preform and connecting an FPC to the outer cylindrical surface of the preform; and forming a coating on the outer cylindrical surface of the preform by using the device for molding an FPC and a plastic part.

An object of the present invention is to provide a technique by which, when producing a resin molded article using an insert member having low pressure resistance, molding can be easily performed, and deformation of the insert member can be suppressed. A method for producing a resin molded article of the present invention, the method includes the steps of disposing an insert member in a cavity of a mold; performing injection of molten resin into the cavity; terminating the injection on and after the molten resin reaches an overflow portion in the cavity and before the molten resin fills the overflow portion; and separating resin in the overflow portion.

A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.