A mold for reducing a molding cycle time and a cost, the mold including a first cavity and a second cavity includes a hot runner that is a flow path to inject a resin injected from an injection unit into the first cavity and the second cavity, and a switching valve configured to divide the flow path into a first flow path connected to the first cavity and a second flow path connected to the second cavity. The injection unit is connected to the first flow path. A pressurizing mechanism is connected to the second flow path.

An injection molding apparatus, comprising: an injection molding machine; a distribution manifold having a distribution channel, a clamp device arranged to clamp together, under a selected clamp force, a mold system having a plurality of mold cavities one or more first downstream channels fluidly coupled to the distribution channel; one or more first gates arranged to deliver injection fluid to a first cavity; one or more second downstream channels fluidly coupled to the distribution channel; one or more second gates arranged to deliver injection fluid to a second cavity; a control system adapted to: instruct the first upstream valve and a second upstream valve; and at least one downstream valve having a valve pin having a control surface for controlling flow of injection fluid.

A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.

A method for performing injection molding using a mold with at least two cavities and an injection cylinder includes supplying resin to be injected into a first cavity, from among the at least two cavities, of the mold to the injection cylinder, injecting the resin into the first cavity, supplying resin to be injected into a second cavity, from among the at least two cavities, of the mold to the injection cylinder, and injecting the resin into the second cavity, wherein the resin injected into the first cavity is cooled, wherein the resin injected into the second cavity is cooled, and wherein molded parts are removed from the first cavity and from the second cavity after the resin in the first cavity has cooled and solidified and the resin the second cavity has cooled and solidified.

An Injection molding apparatus injection molding apparatus (10a) comprising: one or more first downstream channels (166, 166a, 166b) and associated first gates (34, 34a, 34b) that deliver injection fluid (18) to a first cavity (300a) of a mold system (302, 303) and to one or more second downstream channels (168, 168a, 168b) and associated second gates (32, 32a, 32b) that deliver injection fluid to a second cavity (300b) of the mold system (302, 303), the mold system being clamped together under a selected force, the apparatus including a first upstream valve (118) that enables and disables flow of the injection fluid to the first gates (34, 34a, 34b) and a second upstream valve (108) that enables and disables flow of the injection fluid to the one or more second gates (32, 32a, 32b), the apparatus including a control system (20) adapted to open or enable flow of the injection fluid (18) to the one or more first gates (34, 34a, 34b) at a first selected time and to further instruct the second upstream valve (108) to open or enable flow of the injection fluid (18) to the one or more second gates (32, 32a, 32b) at a second selected time that is delayed relative to the first selected time during the course of an injection cycle.

The disclosure provides an injection molding apparatus, including a mold unit, an injecting unit, and a counter pressure unit. The mold unit is adapted to provide a first cavity and a second cavity. The injecting unit is adapted to inject a first material into the first cavity to form a first molded object. The second cavity is adapted to accommodate the first molded object. The injecting unit is adapted to inject a second material into the second cavity to form a second molded object, such that the first molded object and the second molded object in the second cavity are combined. The second material is a foaming material. And the counter pressure unit is adapted to provide gas into the second cavity to increase the pressure in the second cavity.

An Injection molding apparatus injection molding apparatus (10a) comprising: one or more first downstream channels (166, 166a, 166b) and associated first gates (34, 34a, 34b) that deliver injection fluid (18) to a first cavity (300a) of a mold system (302, 303) and to one or more second downstream channels (168, 168a, 168b) and associated second gates (32, 32a, 32b) that deliver injection fluid to a second cavity (300b) of the mold system (302, 303), the mold system being clamped together under a selected force, the apparatus including a first upstream valve (118) that enables and disables flow of the injection fluid to the first gates (34, 34a, 34b) and a second upstream valve (108) that enables and disables flow of the injection fluid to the one or more second gates (32, 32a, 32b),
the apparatus including a control system (20) adapted to open or enable flow of the injection fluid (18) to the one or more first gates (34, 34a, 34b) at a first selected time and to further instruct the second upstream valve (108) to open or enable flow of the injection fluid (18) to the one or more second gates (32, 32a, 32b) at a second selected time that is delayed relative to the first selected time during the course of an injection cycle.

A mold for reducing a molding cycle time and a cost, the mold including a first cavity and a second cavity includes a hot runner that is a flow path to inject a resin injected from an injection unit into the first cavity and the second cavity, and a switching valve configured to divide the flow path into a first flow path connected to the first cavity and a second flow path connected to the second cavity. The injection unit is connected to the first flow path. A pressurizing mechanism is connected to the second flow path.

A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of removing the film from a surface to a midway thereof to form a conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing a conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.

A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.