A method of producing a product utilizing a liner. The method comprises securing, at an injection molding manufacturing system, a liner to a first half of a mold. The method further comprises clamping, at an injection molding manufacturing system, the first half of the mold to a second half of the mold, wherein clamping the first half of the mold to a second half of the mold generates a total mold. The method further comprises generating, at an injection molding manufacturing system, a formed product, wherein generating the formed product further comprises filling an opening of the total mold with a molten material. The method further comprises ejecting, at an injection molding manufacturing system, the formed product, and the liner from a completed first half of the mold and releasing, at an injection molding manufacturing system, the formed product from the liner.

A method of producing a product utilizing a liner. The method comprises securing, at an injection molding manufacturing system, a liner to a first half of a mold. The method further comprises clamping, at an injection molding manufacturing system, the first half of the mold to a second half of the mold, wherein clamping the first half of the mold to a second half of the mold generates a total mold. The method further comprises generating, at an injection molding manufacturing system, a formed product, wherein generating the formed product further comprises filling an opening of the total mold with a molten material. The method further comprises ejecting, at an injection molding manufacturing system, the formed product, and the liner from a completed first half of the mold and releasing, at an injection molding manufacturing system, the formed product from the liner.

A method of producing a product utilizing a liner. The method comprises securing, at an injection molding manufacturing system, a liner to a first half of a mold. The method further comprises clamping, at an injection molding manufacturing system, the first half of the mold to a second half of the mold, wherein clamping the first half of the mold to a second half of the mold generates a total mold. The method further comprises generating, at an injection molding manufacturing system, a formed product, wherein generating the formed product further comprises filling an opening of the total mold with a molten material. The method further comprises ejecting, at an injection molding manufacturing system, the formed product, and the liner from a completed first half of the mold and releasing, at an injection molding manufacturing system, the formed product from the liner.

An electrical connector is used to electrically connect a chip module to a circuit board. The electrical connector has an insulating body, provided with multiple accommodating holes vertically penetrating through the insulating body. An upper surface of the insulating body protrudes upward to form a protruding block located between adjacent ones of the accommodating holes to support the chip module. The protruding block has a first ejector pin surface. The insulating body has a second ejector pin surface adjacent to the protruding block. The first ejector pin surface and the second ejector pin surface are provided for an ejector pin on a mold to push thereon so as to push the insulating body out of the mold. Multiple terminals are correspondingly accommodated in the accommodating holes to be electrically connected to the chip module.

An ejecting apparatus of an injection molding mold, including an ejecting plate on a lower die of the injection molding mold, the ejecting plate configured to be movable in a vertical direction, at least one main ejecting block coupled to a fixed core on the lower die, the at least one main ejecting block configured to be movable in the vertical direction and connected to the ejecting plate, a sub-ejecting block coupled to the at least one main ejecting block, the sub-ejecting block configured to be movable in the vertical direction, and an operating force applier coupled to the at least one main ejecting block and configured to apply operational force to the sub-ejecting block through at least one movable core slidably coupled to the fixed core and the ejecting plate.

An electrical connector is used to electrically connect a chip module to a circuit board. The electrical connector has an insulating body, provided with multiple accommodating holes vertically penetrating through the insulating body. An upper surface of the insulating body protrudes upward to form a protruding block located between adjacent ones of the accommodating holes to support the chip module. The protruding block has a first ejector pin surface. The insulating body has a second ejector pin surface adjacent to the protruding block. The first ejector pin surface and the second ejector pin surface are provided for an ejector pin on a mold to push thereon so as to push the insulating body out of the mold. Multiple terminals are correspondingly accommodated in the accommodating holes to be electrically connected to the chip module.

A mold of a forming tool capable to be used for resin transfer molding processes or injecting molding processes, wherein an inner surface of the mold, which is adapted to limit on one side a forming tool cavity for a product to be fabricated, has an integral surface section which is adapted be moved relatively to adjacent surface areas in a demolding direction. Also a forming tool having such a mold and a method for demolding in which an integral inner surface section acts as membrane and is moved inside the cavity to push the product out of the mold.

A mold (10) comprising a plurality of blocks (11, 13) that, in an assembled position, define a mold cavity, the mold being characterized in that it includes at least one pusher (21), said pusher (21) being configured to be housed in a first block (11) of said plurality, in a side facing the mold cavity, and, when the pusher (21) is housed in said first block (11), to present a first surface (S1) flush with the mold cavity, and in that the mold (10) also includes actuator means (23, 25) enabling the pusher (21) to be moved relative to the first block (11), and sealing means (19, 27) configured to isolate the actuator means (23, 25) from the mold cavity. An associated molding method.

A manufacturing method and a manufacturing device for integrally forming a waterproof structure for a 3C electronic product, and the method includes the following steps: a. feeding a predetermined amount of a solid silicone raw material into a sprue; b. extruding the solid silicone raw material in the sprue, so that the solid silicone raw material flows into, through a silicone inlet channel, a waterproof structure cavity in a mold in which a product is placed; and c. heating the flowable solid silicone with a high temperature in the mold to have a vulcanization reaction, and finally to integrally form a silicone waterproof structure on the product. The waterproof structure is of a great waterproof performance, good material toughness, small wear when being used repeatedly, and great fatigue resistance.

An ejecting apparatus of an injection molding mold, including an ejecting plate on a lower die of the injection molding mold, the ejecting plate configured to be movable in a vertical direction, at least one main ejecting block coupled to a fixed core on the lower die, the at least one main ejecting block configured to be movable in the vertical direction and connected to the ejecting plate, a sub-ejecting block coupled to the at least one main ejecting block, the sub-ejecting block configured to be movable in the vertical direction, and an operating force applier coupled to the at least one main ejecting block and configured to apply operational force to the sub-ejecting block through at least one movable core slidably coupled to the fixed core and the ejecting plate.