A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

The present application describes a modular unit for injection-compression molding (1). The modular unit for injection-compression molding (1) is arranged between the movable platen of the injection machine (21) and the stationary platen of the injection machine (22), in particular in the half-mold bearing face resulting from the division thereof by the opening joint. This modular unit for injection-compression molding (1) allows a substantial reduction of energy spent by reduction of inertial masses involved. The present application describes a modular unit for injection-compression molding (1) to be used in the production of pieces by injection being installed on any thermoplastic molding process.

A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

The invention relates to a method for producing a diaphragm for a diaphragm valve. The method includes the steps of conveying a plastics melt through at least one feed channel into a mold cavity which is delimited by a first mold and a second mold; moving the first and second molds toward one another; removing the at least one diaphragm from the mold cavity; and cutting off a sprue from the at least one diaphragm removed from the mold cavity.

A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

A hot runner device includes a first block and a second block. A supply nozzle is connected to the first block. A nozzle unit is connected to the second block. The first block and the second block are connected to each other so as to be slidable relative to each other along the longitudinal direction of a hot runner block. First and second positioning pins are inserted into first and second insertion holes of the second block. The first insertion hole is larger than the second insertion hole.

An injection moulding apparatus and method for producing a moulded article is disclosed herein. In a described embodiment, the method comprises: (i) securing a layer of film to a part of a first mould half at step 504; (ii) adjusting relative position of the first mould component and a second mould component to an initial moulding position at step 506 to define a mould cavity; (iii) injecting molten moulding material into the mould cavity at step 508 to enable the molten moulding material to contact the layer of protective film; (iv) moving a movable core at step 510 to compress the molten moulding material in the mould cavity; and (v) cooling the compressed molten moulding material at step 514 to bond the layer of film to the cooled moulding material to form the moulded article.

A method is provided for configuring fluid in a programable fluid array which includes applying a sequence of magnetic fields to a movable fluidic network component; which includes a magnetic object to produce a force on the component. In one arrangement the fluid array includes a plurality of pre-formed channels and at least one property of at least one of said pre-formed channels is changed by the movable fluidic network component in another arrangement the fluid array comprises an injection molding system where the programmable fluid array is used to improve the speed and accuracy of the injection molding process and/or to additionally modify the shape and form of a molded object. In this arrangement the fluidic network component follows a path through the mold cavity determined at least in part by a sequence of magnetic fields and exerts a force on molding material therein.

A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

An injection moulding apparatus and method for producing a moulded article is disclosed herein. In a described embodiment, the method comprises: (i) securing a layer of film to a part of a first mould half at step 504; (ii) adjusting relative position of the first mould component and a second mould component to an initial moulding position at step 506 to define a mould cavity; (iii) injecting molten moulding material into the mould cavity at step 508 to enable the molten moulding material to contact the layer of protective film; (iv) moving a movable core at step 510 to compress the molten moulding material in the mould cavity; and (v) cooling the compressed molten moulding material at step 514 to bond the layer of film to the cooled moulding material to form the moulded article.