Tool for plastic injection molding consisting of at least one metallic mold and at least one plastic carrier, wherein the metallic mold and the plastic carrier are connected to one another by an adhesive layer.

An object of the present application is to allow a first cavity mold and a second cavity mold to become integrated with each other in a state in which the first cavity mold constituting an injection cavity mold is inserted into an insertion hole of the second cavity mold, with a cooling flow path for supplying a cooling medium formed between the first cavity mold and the second cavity mold.

Tool for plastic injection molding consisting of at least one metallic mold and at least one plastic carrier, wherein the metallic mold and the plastic carrier are connected to one another by an adhesive layer.

An object of the present application is to allow a first cavity mold and a second cavity mold to become integrated with each other in a state in which the first cavity mold constituting an injection cavity mold is inserted into an insertion hole of the second cavity mold, with a cooling flow path for supplying a cooling medium formed between the first cavity mold and the second cavity mold.

A method for manufacturing a mold includes forming a groove in a back surface of a mold body configured to mold a resin or a rubber by cutting or by electrical discharge machining the back surface of the mold body, placing a porous conductive sheet, including a plurality of through holes and being conductive at least at a surface of the porous conductive sheet, on the back surface of the mold body so as to cover the groove, and temporarily fixing the porous conductive sheet to the back surface of the mold body by spot welded portions, wherein a part of the porous conductive sheet which covers the groove has a flat shape, and performing electroforming to cause an electroformed metal to be electrodeposited on the back surface of the mold body and on the porous conductive sheet.

A mold includes a mold body, a porous conductive sheet and an electroformed metal. The porous conductive sheet is placed on a back surface of the mold body, has a plurality of through holes, and is conductive at least at its surface. The electroformed metal is electrodeposited on the back surface of the mold body and on the porous conductive sheet so as to fill and close the through holes of the porous conductive sheet. In the mold, an inner surface of the electroformed metal forms at least a part of an inner surface of a fluid passage through which fluid for temperature control flows.