The present invention provides for concentrated aqueous silk fibroin solutions and an all-aqueous mode for preparation of concentrated aqueous fibroin solutions that avoids the use of organic solvents, direct additives, or harsh chemicals. The invention further provides for the use of these solutions in production of materials, e.g., fibers, films, foams, meshes, scaffolds and hydrogels.

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

This invention relates to a water-soluble film (WSF) system with embedded/entrapped water-soluble films (WSF). More particularly, the invention relates to a WSF system with actives embedded/entrapped therein such as to provide precise and desired release of actives there from and its method of manufacturing for diverse applications, in which a variety of substances such as detergents, enzymes, softeners, perfumes, pesticides, fungicides, active ingredients, dyes, pigments, hazardous chemicals, active agents for cleaning laundry, dishes, floorings, walls, furniture, fluffs, pulp, etc., and the like can be so embedded/entrapped for such purpose. The invention further discloses novel online and offline process for the manufacture of such multi-layered WSF with or without liners and of desired shapes to selectively entrap interacting/non-interacting materials and their combinations. The process also provides options for the use of a wide range of raw materials, liners such as paper, film, foil, fabric, etc.

A conductive member is provided including a substrate, an interlayer disposed on at least one surface of the substrate, a patterned plating target layer disposed in the form of a mesh on the interlayer having a functional group interacting with a plating catalyst or a precursor thereof, a mesh-shaped metal layer that is disposed on the patterned plating target layer and includes a plurality of crossing thin metal wires, and a protective layer disposed on the metal layer. In a case where “a” represents a modulus of elasticity of the substrate at 25° C. and “b” represents a modulus of elasticity of the interlayer at 25° C., the conductive member satisfies the following Formula A, Formula A: 0.010≤b/a≤0.500, an area ratio of the metal layer is 0.2% to 60%, and a modulus of elasticity of the protective layer at 25° C. is 0.10 to 5.00 GPa.

The present invention provides for concentrated aqueous silk fibroin solutions and an all-aqueous mode for preparation of concentrated aqueous fibroin solutions that avoids the use of organic solvents, direct additives, or harsh chemicals. The invention further provides for the use of these solutions in production of materials, e.g., fibers, films, foams, meshes, scaffolds and hydrogels.

Methods for producing a stretch film are provided, including disposing one or more extruders in fluid communication with a stock of virgin resin; heating the virgin resin to a molten state; delivering the molten virgin resin to a die; and extruding the molten virgin resin through the die onto a casting roll, thereby creating a cast stretch film. Methods for delivering the molten virgin resin onto a casting roll of varying sizes and set temperatures; and of moving a resulting film onto a secondary chill roll of varying sizes and set temperatures, are also provided. Finally, methods for moving the film from either the casting roll or the secondary chill roll onto a slitting assembly, dividing the film using one more interior or exterior slits, and then capturing and gathering the trim waste but not reintroducing the trim waste back into the production process are also disclosed.

The present invention provides stone-plastic hot pressing flooring including a stone-plastic base material part which includes a middle material layer, a stone-plastic substrate layer, and a bottom material layer sequentially arranged side by side; —a color film layer, located at one side of an upper surface of the stone-plastic base material part; —a first wear-resistant layer, located at one side of an upper surface of the color film layer; and —a second wear-resistant layer, located at one side of a lower surface of the stone-plastic base material part; and wherein the middle material layer and the bottom material layer are mainly composed of polyvinyl chloride, plasticizer, stabilizer, carbon black, and stone powder.

A first object according to an embodiment of the present invention is to provide a conductive member which inhibits the breakage of thin metal wires in a case where the conductive member is subjected to a process during which the conductive member is exposed to a high temperature environment and/or a high pressure environment, and has excellent impact resistance. A second object according to the embodiment of the present invention is to provide a touch panel sensor and a touch panel that use the conductive member. A third object according to the embodiment of present invention is to provide a method for manufacturing a molded article using the conductive member.

The conductive member according to an embodiment of the present invention is a conductive member having a substrate, an interlayer disposed on at least one surface of the substrate, a patterned plating target layer that is disposed in the form of a mesh on the interlayer and has a functional group interacting with a plating catalyst or a precursor thereof, a mesh-shaped metal layer that is disposed on the patterned plating target layer and includes a plurality of crossing thin metal wires, and a protective layer disposed on the metal layer, in which in a case where a represents a modulus of elasticity of the substrate at 25 C. and b represents a modulus of elasticity of the interlayer at 25 C., the conductive member satisfies the following Formula A,

0.010b/a0.500Formula A: an area ratio of the metal layer is 0.2% to 60%, and a modulus of elasticity of the protective layer at 25 C. is 0.10 to 5.00 GPa.

In order to provide an elastic medical tape having an especially excellent elastic function and a high effect of alleviating persistent skin irritation during application duration caused by an application-duration shrink force, and applicable to skin that hypersensitively reacts to even insignificant irritation, disclosed is a medical tape for alleviating persistent skin irritation during application duration caused by an application-duration shrink force of an elastic base member of an elastic medical tape, the medical tape including: an elastic base member portion (1) having an elastic function; an adhesive portion (2) having a function of applying and holding the elastic base member portion (1) to skin; and an anti-expansion portion (3) having a function of preventing expansion of the elastic base member portion, the anti-expansion portion (3) overlying the elastic base member portion (1), wherein, after in a manufacturing process, the elastic base member portion (1) and the anti-expansion portion (3) are laminated while the elastic base member portion is in a slacked state or in a not-pulled state, and in the manufacturing process, the elastic base member portion (1) and the anti-expansion portion (3) are laminated while a residual shrink force is not generated in the elastic base member portion (1) in order to reduce the residual shrink force of the elastic base member portion (1), the adhesive portion (2) is applied to skin while preventing expansion of the medical tape, and the anti-expansion portion (3) is then removed.

A film and method of forming a film provides an unmodified starting layer of a starting material, the starting layer having opposed first and second surfaces and an initial thickness, T.sub.1, and a modified surface layer of thickness T.sub.2, which is less than T.sub.1, formed in at least a portion of the second surface, wherein a portion of the modified surface layer is not supported by unmodified starting material removed from the first surface opposite the modified surface layer.