A method of manufacturing a hexagonal boron nitride laminate contains steps of: a) Dissolve dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100-150° C. The substrates can directly be etched or processed to form electric circuits. Substrates can also be completely etched or detached to attain a free standing laminate. Thereby, a hexagonal boron nitride laminate exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

This invention relates to a water-soluble film (WSF) system with embedded/entrapped water-soluble films (WSF). More particularly, the invention relates to a WSF system with actives embedded/entrapped therein such as to provide precise and desired release of actives there from and its method of manufacturing for diverse applications, in which a variety of substances such as detergents, enzymes, softeners, perfumes, pesticides, fungicides, active ingredients, dyes, pigments, hazardous chemicals, active agents for cleaning laundry, dishes, floorings, walls, furniture, fluffs, pulp, etc., and the like can be so embedded/entrapped for such purpose. The invention further discloses novel online and offline process for the manufacture of such multi-layered WSF with or without liners and of desired shapes to selectively entrap interacting/non-interacting materials and their combinations. The process also provides options for the use of a wide range of raw materials, liners such as paper, film, foil, fabric, etc.

This invention relates to a water-soluble film (WSF) system with embedded/entrapped water-soluble films (WSF). More particularly, the invention relates to a WSF system with actives embedded/entrapped therein such as to provide precise and desired release of actives there from and its method of manufacturing for diverse applications, in which a variety of substances such as detergents, enzymes, softeners, perfumes, pesticides, fungicides, active ingredients, dyes, pigments, hazardous chemicals, active agents for cleaning laundry, dishes, floorings, walls, furniture, fluffs, pulp, etc., and the like can be so embedded/entrapped for such purpose. The invention further discloses novel online and offline process for the manufacture of such multi-layered WSF with or without liners and of desired shapes to selectively entrap interacting/non-interacting materials and their combinations. The process also provides options for the use of a wide range of raw materials, liners such as paper, film, foil, fabric, etc.

A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300° C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300° C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

A method for making a coated fabric includes the steps of: applying a coating solution of a resin in an organic solvent to a roller-conveyed non-stretchable and releasable substrate web to form a coating layer; laminating a roller-conveyed base fabric to the coating layer to form a laminate; guiding the laminate to pass through at least one tank containing water to immerse the laminate in water such that the coating layer is solidified and the organic solvent contained in the coating layer is replaced by water; and removing water from the coating layer by drying to leave micropores in the coating layer.

The present invention relates to a method for preparing a surgical anti-adhesion barrier film comprising the following steps: a°) a first solution, comprising an oxidized collagen is prepared, b) a polyphosphate compound is added to the solution of a) in a quantity so as to obtain a concentration of polyphosphate ranging from 0.007 to 0.7%, by weight, with respect to the total weight of the solution, c) the pH of the solution obtained in b) is adjusted to about 9 by addition of a base or to about 5.1 by addition of an acid, d) a diluted solution is prepared by adding water to solution of c), e) a first layer of solution obtained in c) is casted on an inert support, f) before complete gelation of the layer obtained in d), a second layer, of diluted solution obtained in d) is applied on top of said first layer and let to gelify, g) the gelified first and second layers are dried to obtain a film. The invention further relates to a film obtainable by such a method and to a surgical implant comprising a prosthetic fabric and such a film.

The present invention relates to a hyaluronic acid-based dissolving film, a production method thereof, and a release liner used for the same, and more particularly to a method for producing a hyaluronic acid-based dissolving film that provides a hyaluronic acid-based dissolving film having high performance with high productivity through a continuous production process to allow mass production of the dissolving film, a hyaluronic acid-based dissolving film produced by the method, and a release liner suitable for the dissolving film.